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Wide Bandgap Power Semiconductor Packaging
Materials, Components, and Reliability
Tackles the challenges that researchers and engineers face in power electronics packaging, including thermal management, noise reduction, interfacing and more
Katsuaki Suganuma (Edited by)
9780081020944, Elsevier Science
Paperback / softback, published 30 May 2018
240 pages
22.9 x 15.1 x 1.6 cm, 0.4 kg
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.
Part 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates Part 2 Components 4. Magnetic materials Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation Part 4 Future Prospects 9. Future Solutions
Subject Areas: Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Materials science [TGM]
