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Three-Dimensional Integrated Circuit Design
This updated reference explores the latest developments in 3D integrated circuit design, including how to increase speed while conserving energy
Vasilis F. Pavlidis (Author), Ioannis Savidis (Author), Eby G. Friedman (Author)
9780124105010
Paperback, published 3 July 2017
768 pages
23.4 x 19 x 4.6 cm, 1.59 kg
Approx.718 pages
1. Introduction 2. Manufacturing of 3-D Packaged Systems 3. 3-D Integrated Circuit Fabrication Technologies 4. Electrical Modeling and Closed-Form Expressions of Through Silicon Vias 5. Substrate Noise Coupling in Heterogeneous 3-D ICs 6. Design of 3-D ICs with Inductive Links7. Interconnect Prediction Models 8. Cost Issues for 3-D Integrated Systems9. Physical Design Techniques for 3-D ICs 10. Timing Optimization for Two-Terminal Interconnects 11. Timing Optimization for Multi-Terminal Interconnects 12. Thermal Modeling and Analysis 13. Thermal Management Strategies for 3-D ICs 14. Case Study: Thermal Effects in a prototype 3-D IC 15. Three-Dimensional Networks-on-Chip 16. Synchronization in 3-D ICs 17. Case Study: Clock distribution in 3-D ICs 18. Variation Effects on 3-D ICs 19. Power Delivery and Distribution for 3-D ICs20. Case Study: Power Distribution Networks in 3-D ICs 21. Conclusions and Future Prospects AppendixA: Enumeration of Gate Pairs in a 3-D ICB: Formal Proof of Optimum Single Via PlacementC: Proof of the Two-Terminal Via Placement HeuristicD: Proof of Condition for Via Placement of Multi-Terminal Nets GlossaryE: Correlation of WID Variations for Intra-Tier Buffers F: Extension of the Proposed Model to Include Variations of Wires
Subject Areas: Automatic control engineering [TJFM], Electronic devices & materials [TJFD], Circuits & components [TJFC]
