Thin Film Materials
Stress, Defect Formation and Surface Evolution

This graduate textbook provides a comprehensive coverage of the mechanical properties of thin films, with practical examples and homework problems.

L. B. Freund (Author), S. Suresh (Author)

9780521529778, Cambridge University Press

Paperback, published 11 December 2008

770 pages, 75 b/w illus. 75 exercises
24.4 x 17 x 3.9 cm, 1.21 kg

'Thin Film Materials will prove a valuable resource. It contains a wealth of useful references and good indexes. It is richly illustrated, and there are good exercises after each chapter. For a graduate course in the field, it will be hard to beat. And if the authors are right, there will be a growing demand for such courses.' The Times Higher Education Supplement

Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.

1. Introduction and overview
2. Film stress and substrate curvature
3. Stress in anisotropic and patterned films
4. Delamination and fracture
5. Film buckling, bulging and peeling
6. Dislocation formation in epitaxial systems
7. Dislocation interactions and strain relaxation
8. Equilibrium and stability of surfaces
9. The role of stress in mass transport.

Subject Areas: Materials science [TGM], Engineering: general [TBC], Condensed matter physics [liquid state & solid state physics PHFC]