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The Technology of Wafers and Waffles I
Operational Aspects
A comprehensive reference manual on wafer and waffle technology that explores product types, development, ingredients, manufacturing and quality assurance
Karl F. Tiefenbacher (Author)
9780128094389, Elsevier Science
Paperback, published 18 May 2017
712 pages
23.4 x 19 x 4.3 cm, 1.47 kg
The Technology of Wafers and Waffles: Operational Aspects is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing. The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.
1. Introduction2. Technology of Main Ingredients--Water and Flours3. Technology of Main Ingredients--Sweeteners and Lipids4. Technology of Minor Ingredients for Wafers and Waffles5. Adjuncts--Filling Creams, Inclusions, Cacao and Chocolate6. Wafer Sheets: Technology and Products7. Technology of Other Crisp Wafers8. After Bake Technology of Crisp Wafers and of Waffles9. Waffles: An Overview in Technology
Subject Areas: Food & beverage technology [TDCT]
