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The Basics of Soldering

Armin Rahn (Author)

9780471584711, Wiley

Hardback, published 17 May 1993

400 pages
23.1 x 15.6 x 2.8 cm, 0.658 kg

Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.

Soldering.

Surface Mount Technology.

Solder Defects.

Cleaning.

Statistical Quality Control.

Index.

Subject Areas: Electronics & communications engineering [TJ]

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