Soldering Processes and Equipment

Michael G. Pecht (Edited by), MG Pecht (Author)

9780471591672, Wiley

Hardback, published 6 July 1993

312 pages
22 x 15.8 x 2.3 cm, 0.549 kg

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Solders, Solder Fluxes, and Solder Pastes.

Wave Soldering.

Reflow Soldering.

Cleaning and Contamination.

Reliability and Quality.

Rework, Repair, and Manual Assembly.

Appendix.

Glossary of Soldering Terms.

Index.

Subject Areas: Mechanical engineering & materials [TG]