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Soldering in Electronics Assembly
MIKE JUDD (Author), Keith Brindley (Author)
9780750635455
Hardback, published 26 March 1999
369 pages
23.3 x 15.6 x 2.5 cm, 0.88 kg
"This excellent book clearly explains soldering processes, solder, flux, cleaning and quality control, as they apply to printed circuit board assembly. The book deserves a place on the desk or bench of everyone involved in the practical business of modern machine soldering in electronics." --ITRI Journal
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.
Soldering process
Electronics assemblies
Solder
Flux
CS soldering processes
SC soldering processes
BGA technology
Cleaning of soldered assemblies
Avoiding problems - soldering quality
Standards and specifications
Glossary
References
Worldwide addresses
Appendices: Why not blame the machine?, Problems and solutions, Soldering safety, Comparing soldering processes and machines
Subject Areas: Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Engineering skills & trades [TGX], Other manufacturing technologies [TDP]
