Reflow Soldering
Apparatus and Heat Transfer Processes

An investigation of the technology of reflow soldering utilizing soldering ovens and apparatus

Balázs Illés (Author), Oliver Krammer (Author), Attila Geczy (Author)

9780128185056, Elsevier Science

Paperback, published 2 July 2020

294 pages, 150 illustrations (30 in full color)
22.9 x 15.1 x 1.9 cm, 0.48 kg

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries.

1. Introduction to Surface Mounting Technology2. Infrared ovens3. Convection ovens4. Vapor Phase Soldering (VPS) ovens5. Special reflow ovens6. Numerical simulation of reflow ovens

Subject Areas: Materials science [TGM], Other manufacturing technologies [TDP]