Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Provides an overview of modeling and analysis techniques for predicting and evaluating electrical, thermal and mechanical performance in 2.5 and 3D packaging

Hengyun Zhang (Author), Faxing Che (Author), Tingyu Lin (Author), Wensheng Zhao (Author)

9780081025321, Elsevier Science

Paperback / softback, published 15 November 2019

434 pages
22.9 x 15.1 x 2.7 cm, 0.7 kg

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

1. Introduction
2. Electrical modeling and design
3. Thermal modeling, analysis, and design
4. Stress and reliability analysis for interconnects
5. Reliability and failure analysis of encapsulated packages
6. Thermal and mechanical tests for packages and materials
7. System-level modeling, analysis, and design

Subject Areas: Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Materials science [TGM]