Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

G. S. Oehrlein (Edited by), K. Maex (Edited by), Y. -C. Joo (Edited by), S. Ogawa (Edited by), J. T. Wetzel (Edited by)

9781107413153, Cambridge University Press

Paperback / softback, published 5 June 2014

614 pages
22.9 x 15.2 x 3.2 cm, 0.81 kg

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

Subject Areas: Materials science [TGM], Technology: general issues [TB]