Materials Aspects in Microsystem Technologies

D. Barbier (Edited by), J.R. Morante (Edited by), P. Temple-Boyer (Edited by), G. Mueller (Edited by), W. Lang (Edited by)

9780080436111

Hardback, published 13 August 1999

0 pages
27.8 x 21 x 1.3 cm, 0.74 kg

Chapter headings and selected papers: Materials Deposition and Microstructuring. Roughning and smoothing dynamics during KOH silicon etching (R. Divan et al.). Silicon elastomer as a protective layer in 3D microfabrication of micro-opto-electro-mechanical systems (P. Obreja et al.). Growth of piezoelectric thin films with fine grain microstructure by high energy pulsed laser deposition (F. Craciun et al.). Obtention and characterization of bioengineered layers onto silica-based microstructures (S. Falipou et al.). Microstructure of Cu-C interface in Cu-based metal matrix composite (A. Berner et al.). Porous Silicon in Microsystems. Porous silicon technique for realization of surface micromachined silicon structures with large gaps (H. Artmann, W. Frey). Characterization. Characterization of the nonlinear optical properties of crystals by the SHEW technique (R. Kremer et al.). Bonding and Packaging. Devices. Microstructures of the monomorph piezoelectric ceramic actuators with functional gradients (X. Zhu et al.). Electrostatically actuated micromirror devices in silicon technology (W. Lang et al.). A thermoelectric converter for energy supply (H. Glosch et al.). Author index. Subject index.

Subject Areas: Electronics engineering [TJF], Mechanical engineering & materials [TG]