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Joining Processes for Dissimilar and Advanced Materials
Covers a wide range of innovative joining processes for use with dissimilar and high-performance materials, along with characterization, simulation, and digitalization methods for joints
Pawan Kumar Rakesh (Edited by), J Paulo Davim (Edited by)
9780323853996, Elsevier Science
Paperback / softback, published 22 November 2021
692 pages, 70 illustrations (50 in full color)
22.9 x 15.2 x 4.2 cm, 1 kg
Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product.
1. Introduction to the Joining Process 2. Investigation on Microwave Joining of Mild Steel Plates at 2.45 GHz and Joint Characterization 3. Joint Design for Adhesive Joining of Sisal/Epoxy Composite Laminates 4. Electric current-assisted joining of similar/dissimilar materials 5. Use of combustion synthesis/self-propagating high-temperature synthesis (SHS) for the joining of similar/dissimilar materials 6. A Review on Friction Stir Spot Welding of Similar and Dissimilar Materials 7. Current and Future Trends in Micro Joining and Nano Joining 8. Joint Characterization/ Testing 9. Modelling and Simulations 10. Digitalization of Joining
Subject Areas: Mechanical engineering [TGB]
