Integration Techniques for Micro/Nanostructure-based Large-Area Electronics

Describes the various approaches for synthesising nanostructures, and their integration onto large-area flexible/stretchable substrates.

Carlos García Núñez (Author), Fengyuan Liu (Author), Sheng Xu (Author), Ravinder Dahiya (Author)

9781108703529, Cambridge University Press

Paperback / softback, published 8 November 2018

75 pages, 24 b/w illus.
23 x 15 x 0.5 cm, 0.2 kg

Advanced nanostructured materials such as organic and inorganic micro/nanostructures are excellent building blocks for electronics, optoelectronics, sensing, and photovoltaics because of their high-crystallinity, long aspect-ratio, high surface-to-volume ratio, and low dimensionality. However, their assembly over large areas and integration in functional circuits are a matter of intensive investigation. This Element provides detailed description of various technologies to realize micro/nanostructures based large-area electronics (LAE) devices on rigid or flexible/stretchable substrates. The first section of this Element provides an introduction to the state-of-the-art integration techniques used to fabricate LAE devices based on different kind of micro/nanostructures. The second section describes inorganic and organic micro/nanostructures, including most common and promising synthesis procedures. In the third section,different techniques are explained that have great potential for integration of micro/nanostructures over large areas. Finally, the fourth section summarizes important remarks about LAE devices based on micro/nanostructures, and future directions.

1. Introduction
2. Nanostructures
3. Large-area printing and integration
4. Conclusions.

Subject Areas: Electronic devices & materials [TJFD], Circuits & components [TJFC], Electronics engineering [TJF]