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Integration of Passive RF Front End Components in SoCs
Describes and evaluates recent developments in the integration of passive components in wireless RF front ends, using real-world examples.
Hooman Darabi (Author), Ahmad Mirzaei (Author)
9780521111263, Cambridge University Press
Hardback, published 10 January 2013
200 pages, 110 b/w illus. 3 tables
25.3 x 17.7 x 1.2 cm, 0.56 kg
Examining the most important developments in highly integrated wireless RF front ends, this book describes and evaluates both active and passive solutions for on-chip high-Q filtering, and explores M-phase filters in depth. An accessible step-by-step approach is used to introduce everything an RF designer needs to know about these filters, including their various forms, principles of operation, and their performance against implementation-related imperfections. Real-world examples are described in depth, and detailed mathematical analyses demonstrate the practical quantification of pertinent circuit parameters.
1. Introduction to highly integrated and tunable RF receiver front ends: 1.1. Introduction
1.2. Front-end integration challenges and system requirements
1.3. 2G receiver SAW elimination
1.4. 3G receiver SAW elimination
1.5. Summary and conclusions
2. Active blocker-cancellation techniques in receivers: 2.1. Introduction
2.2. Concept of receiver translational loop
2.3. Nonideal effects
2.4. Circuit implementations
2.5. Measurement results
2.6. Feedback blocker-cancellation techniques
2.7. Summary and conclusions
3. Impedance transformation: Introduction to the simplest on-chip SAW filter
3.1. Introduction
3.2. Impedance transformation by a 50% passive mixer
3.3. Application as on-chip SAW filter
3.4. Impact of harmonics on the sharpness of the proposed filter
3.5. Differential implementation
3.6. Summary and conclusions
4. Four-phase high-Q bandpass filters: 4.1. Introduction
4.2. Impedance transformation by a four-phase filter
4.3. Differential implementation of four-phase high-Q bandpass filter
4.4. Application as an on-chip SAW filter
4.5. Impact of harmonics on the sharpness of the proposed filter
4.6. Four-phase high-Q bandpass filter with a complex baseband impedance
4.7. Four-phase high-Q bandpass filter with quadrature RF inputs
4.8. Harmonic upconversion and downconversion
4.9. A SAW-less receiver with on-chip four-phase high-Q bandpass filters
4.10. Summary and conclusions
5. M-phase high-Q bandpass filters: 5.1. Introduction
5.2. Impedance transformation by M-phase filters
5.3. Differential implementation of M-phase high-Q filter
5.4. Application as an on-chip SAW filter
5.5. Impact of harmonics on the sharpness of the M-phase bandpass filter
5.6. M-phase high-Q filter with complex baseband impedances
5.7. M-phase high-Q bandpass filter with quadrature RF inputs
5.8. M-phase high-Q bandpass filter with N-phase complex bandpass filters
5.9. Harmonic upconversion
5.10. Summary and conclusions
6. Design of a superheterodyne receiver using M-phase filters: 6.1. Introduction
6.2. Proposed superheterodyne receiver architecture
6.3. Design and implementation of the receiver chain
6.4. Measurement results
6.5. Summary and conclusions
7. Impact of imperfections on the performance of M-phase filters: 7.1. Introduction
7.2. Mathematical background
7.3. LO phase noise
7.4. Second-order nonlinearity in the switches of the bandpass filter
7.5. Quadrature error in the original 50% duty-cycle clock phases
7.6. Harmonic downconversion
7.7. Thermal noise of switches
7.8. Parasitic capacitors of switches
7.9. Switch charge injection
7.10. Mismatches
7.11. Summary and conclusions
8. M-phase filtering and duality: 8.1. Introduction
8.2. Dual of an electrical circuit
8.3. Dual of M-phase filter
8.4. Dual of M-phase high-Q filter with complex baseband impedances
8.5. Summary and conclusions
Appendix
References
Index.
Subject Areas: Communications engineering / telecommunications [TJK], Microwave technology [TJFN], Circuits & components [TJFC], Electronics engineering [TJF], Electronics & communications engineering [TJ], Electrical engineering [THR]