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Integrated Photonics for Data Communication Applications
An introduction to the key principles and advances of application-specific photonic integrated circuits (PICs) from leaders across industry and academia
Madeleine Glick (Edited by), Ling Liao (Edited by), Katharine Schmidtke (Edited by)
9780323912242, Elsevier Science
Paperback / softback, published 27 July 2023
522 pages, 120 illustrations (90 in full color)
22.9 x 15.2 x 2.8 cm, 0.45 kg
Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances.
1. Applications and Key Performance Indicators for Data Communications 2. Integrated Semiconductor Lasers 3. Integrated Optical Modulators 4. Integrated Photodetectors 5. Passive Silicon Photonic Devices 6. Coherent PICs for Data Center Interconnects 7. PICs for switched network interconnects 8. Photonics Switch Fabrics in Datacentre/HPC networks 9. PICs and Optical Fabrics for Heterogenous Compute Systems 10. PIC Design Methods and Tools 11. PIC Fabrication, and Test Approaches 12. PIC Packaging & Test Technologies for DC and HPC Applications 13. PIC Quality and Reliability for DC and HPC Applications
Subject Areas: Applied optics [TTB], Communications engineering / telecommunications [TJK], Electronics & communications engineering [TJ], Materials science [TGM]
