High-Density Integrated Electrocortical Neural Interfaces
Low-Noise Low-Power System-on-Chip Design Methodology

Presents the latest electrocorticography and integrated circuit design technologies used to develop minimally invasive brain-computer interfaces

Sohmyung Ha (Author), Chul Kim (Author), Patrick P. Mercier (Author), Gert Cauwenberghs (Author)

9780128151150, Elsevier Science

Paperback, published 6 August 2019

210 pages
23.4 x 19 x 1.5 cm, 0.43 kg

High-Density Integrated Electrocortical Neural Interfaces provides a basic understanding, design strategies and implementation applications for electrocortical neural interfaces with a focus on integrated circuit design technologies. A wide variety of topics associated with the design and application of electrocortical neural implants are covered in this book. Written by leading experts in the field— Dr. Sohmyung Ha, Dr. Chul Kim, Dr. Patrick P. Mercier and Dr. Gert Cauwenberghs —the book discusses basic principles and practical design strategies of electrocorticography, electrode interfaces, signal acquisition, power delivery, data communication, and stimulation. In addition, an overview and critical review of the state-of-the-art research is included.

1. Introduction to ECoG and ECoG Interfaces2. Electrode-to-Brain Interfaces3. Integrated Circuit Interfaces for Data Acquisition4. Integrated Circuit Interfaces for Stimulation5. Power Management for mm-sized ECoG Implants6. RF Power Transfer and its Considerations7. Wireless Data Communication8. Fully Integrated Modular ECoG Recording and Stimulation

Subject Areas: Biomedical engineering [MQW]