Skip to product information
1 of 1
Regular price £124.99 GBP
Regular price £160.00 GBP Sale price £124.99 GBP
Sale Sold out
Free UK Shipping

Freshly Printed - allow 10 days lead

Handbook of Materials Failure Analysis
With Case Studies from the Electronic and Textile Industries

Presents case studies and tactics in failure analysis for engineers and researchers working to mitigate materials-related failures within electronics and textiles

Abdel Salam Hamdy Makhlouf (Edited by), Mahmood Aliofkhazraei (Edited by)

9780081019375, Elsevier Science

Hardback, published 25 October 2019

384 pages
23.4 x 19 x 2.6 cm, 1.02 kg

Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners.

Part 1: Electronics Industries 1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method 2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry 3. Failure of intermetallic solder ball due to stress shielding and amplification effects 4. Assessment of the indoor corrosion in consumer electronics in subtropical climates. 5. Pb-free Solder – Microstructural, Material Reliability and Failure Relationships 6. The Role of Contamination in Failures of Electronics – Case Studies 7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology 8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application 9. New methodology for qualification and lifetime assessment of electronic systems

Part 2: Textiles Industries 10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique 11. Failure of yarns in different textile applications 12. Treatment effect on failure mode of industrial carbon textile at elevated temperature

Subject Areas: Electronic devices & materials [TJFD], Electronics engineering [TJF], Materials science [TGM], Metals technology / metallurgy [TDM]

View full details