Handbook of Chemical Vapor Deposition
Principles, Technology and Applications

A clear, objective and systematic assessment of CVD. Includes an examination of the theory of the process and description of the major CVD chemicals and reactions

Hugh O. Pierson (Author)

9780815514329

Hardback, published 1 September 1999

506 pages
22.9 x 15.1 x 3 cm, 0.97 kg

"...presents an objective and systematic assessment." --High Tech Ceramics News

Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.

Introduction and General ConsiderationsFundamentals of Chemical Vapor DepositionThe Chemistry of CVDMetallo-Organic CVD (MOCVD)CVD Processes and EquipmentThe CVD of MetalsThe CVD of the Allotropes of CarbonThe CVD of Non-Metallic ElementsThe CVD of Ceramic Materials: CarbidesThe CVD of Ceramic Materials: NitridesThe CVD of Ceramic Materials: OxidesThe CVD of Ceramic Materials: Borides, Silicides, III-V Compounds and II-VI Compounds (Chalcogenides)CVD in Electronic Applications: SemiconductorsCVD in Electronic Applications: Conductors, Insulators, and Diffusion BarriersCVD in Optoelectronic and Ferroelectric ApplicationsCVD in Optical ApplicationsCVD in Wear- and Corrosion-Resistant ApplicationsCVD in Cutting-Tool ApplicationsCVD in Fiber, Powder, and Monolithic ApplicationsConversion GuideAppendix: Alternative Processes for Thin-Film Deposition and Surface Modification

Subject Areas: Microprocessors [TJFD1], Materials science [TGM], Metals technology / metallurgy [TDM], Industrial chemistry & manufacturing technologies [TD]