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Ferroelectricity in Doped Hafnium Oxide
Materials, Properties and Devices
Summarizes new information on HfO2, an emerging ferroelectric material, compares it to other materials, and considers its implementation in semiconductor devices
Uwe Schroeder (Edited by), Cheol Seong Hwang (Edited by), Hiroshi Funakubo (Edited by)
9780081024300, Elsevier Science
Paperback / softback, published 29 March 2019
570 pages
22.9 x 15.1 x 3.5 cm, 0.91 kg
Ferroelectricity in Doped Hafnium Oxide: Materials, Properties and Devices covers all aspects relating to the structural and electrical properties of HfO2 and its implementation into semiconductor devices, including a comparison to standard ferroelectric materials. The ferroelectric and field-induced ferroelectric properties of HfO2-based films are considered promising for various applications, including non-volatile memories, negative capacitance field-effect-transistors, energy storage, harvesting, and solid-state cooling. Fundamentals of ferroelectric and piezoelectric properties, HfO2 processes, and the impact of dopants on ferroelectric properties are also extensively discussed in the book, along with phase transition, switching kinetics, epitaxial growth, thickness scaling, and more. Additional chapters consider the modeling of ferroelectric phase transformation, structural characterization, and the differences and similarities between HFO2 and standard ferroelectric materials. Finally, HfO2 based devices are summarized.
1. Fundamentals of Ferroelectric and piezoelectric properties 2. HfO2 processes 3. Dopant screening for optimization of the ferroelectric properties 4. Electrode screening for capacitor applications 5. Phase transition 6. Switching kinetics 7. Impact of oxygen vacancies 8. Epitaxial growth of ferroelectric HfO2 9. Thickness scaling Chapter 10. Simulation/Modelling 11. Structural characterization on a nanometer scale: PFM, TEM 12. Comparison to standard ferroelectric materials 13. FE HfO2 based devices
Subject Areas: Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Materials science [TGM]
