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Defects in Advanced Electronic Materials and Novel Low Dimensional Structures

Comprehensive overview of the latest advances in defect engineering of conventional bulk semiconductors and the emerging novel 1D and 2D material systems

Jan Stehr (Edited by), Irina Buyanova (Edited by), Weimin Chen (Edited by)

9780081020531, Elsevier Science

Paperback / softback, published 21 June 2018

306 pages
22.9 x 15.1 x 2 cm, 0.5 kg

Defects in Advanced Electronic Materials and Novel Low Dimensional Structures provides a comprehensive review on the recent progress in solving defect issues and deliberate defect engineering in novel material systems. It begins with an overview of point defects in ZnO and group-III nitrides, including irradiation-induced defects, and then look at defects in one and two-dimensional materials, including carbon nanotubes and graphene. Next, it examines the ways that defects can expand the potential applications of semiconductors, such as energy upconversion and quantum processing. The book concludes with a look at the latest advances in theory.

While defect physics is extensively reviewed for conventional bulk semiconductors, the same is far from being true for novel material systems, such as low-dimensional 1D and 0D nanostructures and 2D monolayers. This book fills that necessary gap.

1. Point defects in ZnOMatthew D. McCluskey2. Point defects in group III nitridesBo Anders Monemar and Plamen P. Paskov3. Defects in 1D-NanowiresJan Stehr4. Defects in carbon nanotubesAli Ghavamian, Maksym Rybachuk and Andreas Öchsner5. Defects in grapheneLitao Sun and Tao Xu6. Defects in 2D-materialsWu Zhou and Junhao Lin7. Energy upconversion promoted by defectsIrina Buyanova8. Defects for quantum information processing in SiCGeorgy Astakhov and Vladimir Dyakonov9. Defects for quantum information processing in SiEisuke Abe and Kohei Itoh10. Room temperature defect engineered spintronics in dilute nitridesWeimin M. Chen

Subject Areas: Applied optics [TTB], Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Materials science [TGM]

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