Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Rajiv K. Singh (Edited by), Rajeev Bajaj (Edited by), Mansour Moinpour (Edited by), Marc Meuris (Edited by)

9781107413146, Cambridge University Press

Paperback / softback, published 5 June 2014

176 pages
22.9 x 15.2 x 1 cm, 0.24 kg

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.

Subject Areas: Materials science [TGM], Industrial chemistry & manufacturing technologies [TD]