Ceramic Thick Films for MEMS and Microdevices

MEMS (Micro Electro-Mechanical Systems) devices are widely used across a wide range of industry sectors, in applications as diverse as ink jet printers and minute biosensors used to monitor blood pressure. Rob Dorey provides a complete guide to the integration of thick films into functional micro-devices, for engineers and researchers in the semiconductor / MEMS industry, and those involved in the wider spectrum of MEMS applications.

Robert A. Dorey (Author)

9780128103579, Elsevier Science

Paperback, published 19 August 2016

192 pages
23.4 x 19 x 1.3 cm, 0.41 kg

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications – forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.

Integration and applications

Subject Areas: Electronic devices & materials [TJFD], Materials science [TGM], Ceramics & glass technology [TDCQ]