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Ceramic Integration and Joining Technologies
From Macro to Nanoscale
Mrityunjay Singh (Edited by), M Singh (Author), Tatsuki Ohji (Edited by), Rajiv Asthana (Edited by), Sanjay Mathur (Edited by)
9780470391228, Wiley
Hardback, published 18 November 2011
830 pages
24.4 x 16.3 x 4.5 cm, 1.261 kg
This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
Preface ix Contributors xi PART I INTRODUCTION 1 1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES 3 PART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION 15 2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES 17 3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY 39 4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC AND CERAMIC–METAL JOINING 91 5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143 6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163 7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOINING AND INTEGRATION 193 PART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION 231 8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS 233 9 OXIDE THERMOELECTRIC POWER GENERATION 267 10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS 297 11 INTEGRATION TECHNOLOGIES FOR SENSORS 323 12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339 13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION 393 14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY 415 15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FOR TUNABLE MICROWAVE APPLICATIONS 449 16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES 489 PART IV NANO- AND BIOINTEGRATION 521 17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY 523 18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575 19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS) 641 20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671 21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699 22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS 721 23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS 743 24 BIOINTEGRATION OF PROSTHETIC DEVICES 777 Index 803
Mrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and Sanjay Mathur
Jolanta Janczak-Rusch
Monica Ferraris, Milena Salvo, and Valentina Casalegno
K. S. Weil, J. T. Darsell, and J. Y. Kim
Michael C. Halbig and Mrityunjay Singh
Mrityunjay Singh and Rajiv Asthana
V. M. Perevertailo and O. B. Loginova
Richard Matz
Ryoji Funahashi, Saori Urata, Atsuko Kosuga, and Delphine Flahaut
Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, Koichi Hamamoto, Masanobu Awano, and Nigel Sammes
Woosuck Shin, Maiko Nishibori, and Ichiro Matsubara
Talha Erdem and Hilmi Volkan Demir
Takashi Goto
Cher Ming Tan and Yuejin Hou
Ashok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy
Jun Akedo
Yoshitake Masuda and Kunihito Koumoto
F. Hernández-Ramírez, J. D. Prades, A. Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur
Xijun Li and Daniel H. C. Chua
D. Pliszka, S. Sundarrajan, and S. Ramakrishna
C. Jin, W. Wei, R. Aggarwal, and R. J. Narayan
Ataur Sarkar and M. Saif Islam
Umur Caglar, Ville Pekkanen, Jani Valkama, Pauliina Mansikkamäki, and Jussi Pekkanen
Masakazu Kawashita, Toshiki Miyazaki, and Chikara Ohtsuki
Subject Areas: Mechanical engineering & materials [TG]
