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BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage
Discusses the standard compact model BSIM-BULK (formerly BSIM6), including mathematical derivations, approximations, numerical techniques and parameter extractions
Chenming Hu (Author), Harshit Agarwal (Author), Chetan Gupta (Author), Yogesh Singh Chauhan (Author)
9780323856775, Elsevier Science
Paperback / softback, published 3 May 2023
270 pages, Approx. 200 illustrations (200 in full color)
22.9 x 15.2 x 1.8 cm, 1 kg
BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia. Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.
1. Background
2. BSIM-BULK Core Model
3. Real Device Effects
4. Leakage current and thermal effects
5. BSIM-BULK Charge and Capacitance Model
6. Noise and RF Modeling
7. Junction Diode and Layout Dependent Parasitic Model
8. Compact Modeling of High Voltage Devices
9. Parameter Extraction
10. BSIM-BULK Model Quality Testing
Subject Areas: Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Engineering skills & trades [TGX], Materials science [TGM]
