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Advances in CMP Polishing Technologies
In a field where commercial confidentiality has limited the spread of knowledge, this book opens up emerging technologies and new applications to a wide audience of engineers in the semiconductor industry and beyond
Toshiro Doi (Edited by), Ioan D. Marinescu (Edited by), Syuhei Kurokawa (Edited by)
9781437778595, Elsevier Science
Hardback, published 20 December 2011
328 pages
22.9 x 15.1 x 2.4 cm, 0.55 kg
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
Chapter 1: Introduction Chapter 2: Device fabrication with a silicon crystal substrate Chapter 3: Ultra-precision technology – taking silicon single crystal as an example Chapter 4: Applications of ultra-precision CMP in device processes Chapter 5: The future of processing technology Chapter 6: Progress of the semiconductor and silicon industries Chapter 7: Summary
Subject Areas: Electronic devices & materials [TJFD], Electronics & communications engineering [TJ], Mechanical engineering [TGB], Technical design [TBD], Physics [PH]
