Advanced Metallization Conference 2006 (AMC 2006): Volume 22

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Stephen W. Russell (Edited by), Michael E. Mills (Edited by), Akihiko Osaki (Edited by), Takashi Yoda (Edited by)

9781558999473, Materials Research Society

Hardback, published 1 January 2007

0 pages
23.5 x 15.8 x 4.1 cm, 1.07 kg

The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.

Subject Areas: Materials science [TGM]