{"product_id":"wide-bandgap-power-semiconductor-packaging-materials-components-and-reliability-paperback-9780081020944","title":"Wide Bandgap Power Semiconductor Packaging; Materials, Components, and Reliability (Paperback \/ softback) 9780081020944","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eWide Bandgap Power Semiconductor Packaging\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eMaterials, Components, and Reliability\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cem\u003e\u003cp\u003eTackles the challenges that researchers and engineers face in power electronics packaging, including thermal management, noise reduction, interfacing and more\u003c\/p\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eKatsuaki Suganuma (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780081020944, Elsevier Science\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 30 May 2018\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e240 pages\u003cbr\u003e22.9 x 15.1 x 1.6 cm, 0.4 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e\u003ci\u003eWide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability\u003c\/i\u003e addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.\u003c\/p\u003e  \u003cp\u003eAs wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. \u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cb\u003ePart 1 Fundamentals and Materials\u003c\/b\u003e 1. Introduction 2. Interconnect Technologies 3. Substrates\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart 2 Components\u003c\/b\u003e 4. Magnetic materials\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart 3 Performance Measurement and Reliability Evaluation\u003c\/b\u003e 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart 4 Future Prospects\u003c\/b\u003e 9. Future Solutions\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronic devices \u0026amp; materials [\u003ca title=\"See our other books on Electronic devices \u0026amp; materials\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronic%20devices%20\u0026amp;%20materials%20%5BTJFD%5D%22\"\u003eTJFD\u003c\/a\u003e], Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e], Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Woodhead Publishing","offers":[{"title":"Default Title","offer_id":46649162105112,"sku":"9780081020944","price":109.59,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9780081020944_dfbbcb2d-768a-435f-b350-96864a0346a5.jpg?v=1695006372","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/wide-bandgap-power-semiconductor-packaging-materials-components-and-reliability-paperback-9780081020944","provider":"Freshly Printed Books","version":"1.0","type":"link"}