{"product_id":"ulsi-semiconductor-technology-atlas-hardback-9780471457725","title":"ULSI Semiconductor Technology Atlas (Hardback) 9780471457725","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eULSI Semiconductor Technology Atlas\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cfont size=\"4\"\u003eChih-Hang Tung (Author), George T. T. Sheng (Author), Chih-Yuan Lu (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780471457725, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 14 October 2003\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e680 pages\u003cbr\u003e26 x 18.4 x 3.7 cm, 1.37 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cem\u003e\u003cfont size=\"3\"\u003e\"...provides a historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issue.\" (\u003ci\u003eIEEE Solid-State Circuits Society Newsletter\u003c\/i\u003e, January 2004)  \u003cp\u003e\"…strongly recommended…\" \u003ci\u003e(E-Streams\u003c\/i\u003e, Vol. 7, No. 4)\u003c\/p\u003e\u003c\/font\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eMore than 1,100 TEM images illustrate the science of ULSI\u003cbr\u003e \u003cbr\u003e The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems.\u003cbr\u003e \u003cbr\u003e The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts:\u003cbr\u003e * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation \u003cbr\u003e * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides\/salicides, and metallization \u003cbr\u003e * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development \u003cbr\u003e * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics \u003cbr\u003e \u003cbr\u003e \u003cbr\u003e This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with:\u003cbr\u003e * More than 1,100 TEM images to illustrate the science of ULSI\u003cbr\u003e * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues\u003cbr\u003e * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003eFOREWORD ix\u003c\/p\u003e \u003cp\u003ePREFACE xi\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART I 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1 Microelectronics and Microscopy 3\u003c\/p\u003e \u003cp\u003e2 ULSI Process Technology 36\u003c\/p\u003e \u003cp\u003e3 Applications of TEM for Construction Analysis 61\u003c\/p\u003e \u003cp\u003e4 TEM Sample Preparation Techniques 90\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART II 141\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5 Ion Implantation and Substrate Defects 143\u003c\/p\u003e \u003cp\u003e6 Dielectrics and Isolation 179\u003c\/p\u003e \u003cp\u003e7 Silicides, Polycide, and Salicide 256\u003c\/p\u003e \u003cp\u003e8 Metallization and Interconnects 287\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART III 343\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9 ULSI Devices I: DRAM Cell with Planar Capacitor 345\u003c\/p\u003e \u003cp\u003e10 ULSI Devices II: DRAM Cell with Stacked Capacitor 365\u003c\/p\u003e \u003cp\u003e11 ULSI Devices III: DRAM Cell with Trench Capacitor 399\u003c\/p\u003e \u003cp\u003e12 ULSI Devices IV: SRAM 445\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART IV 475\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13 TEM in Failure Analysis 477\u003c\/p\u003e \u003cp\u003e14 Novel Devices and Materials 526\u003c\/p\u003e \u003cp\u003e15 TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies 558\u003c\/p\u003e \u003cp\u003e16 High-Resolution TEM in Microelectronics 609\u003c\/p\u003e \u003cp\u003eINDEX 647\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley-Interscience","offers":[{"title":"Brand New","offer_id":52293482184984,"sku":"9780471457725","price":200.95,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780471457725.jpg?v=1781641545","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/ulsi-semiconductor-technology-atlas-hardback-9780471457725","provider":"Freshly Printed Books","version":"1.0","type":"link"}