{"product_id":"tsv-3d-rf-integration-high-resistivity-si-interposer-technology-paperback-9780323996020","title":"TSV 3D RF Integration; High Resistivity Si Interposer Technology (Paperback \/ softback) 9780323996020","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eTSV 3D RF Integration\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eHigh Resistivity Si Interposer Technology\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cem\u003eSystematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing high frequency loss and high integration level\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eShenglin Ma (Author), Yufeng Jin (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780323996020, Elsevier Science\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 27 April 2022\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e292 pages\u003cbr\u003e23.5 x 19 x 1.9 cm, 0.63 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e\u003ci\u003eTSV 3D RF Integration: High Resistivity Si Interposer Technology\u003c\/i\u003e systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. \u003c\/p\u003e  \u003cp\u003eA series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. \u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e1. Introduction to HR-Si Interposer Technology 2. Design, process and electrical verification of HR-Si interposer 3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer 4. HR-Si TSV integrated inductor 5. Verification of 2.5D\/3D heterogeneous RF integration of HR-Si interposer 6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel 7. Patch Antenna in Stacked HR-Si interposers 8. Through Glass Via Technology 9. Conclusion and outlook\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Elsevier","offers":[{"title":"Default Title","offer_id":46651395539224,"sku":"9780323996020","price":147.69,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9780323996020_b4d9eeb6-5bde-4105-99d5-ec3418b9197e.jpg?v=1694976367","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/tsv-3d-rf-integration-high-resistivity-si-interposer-technology-paperback-9780323996020","provider":"Freshly Printed Books","version":"1.0","type":"link"}