{"product_id":"three-dimensional-integrated-circuit-design-paperback-9780123743435","title":"Three-dimensional Integrated Circuit Design (Paperback \/ softback) 9780123743435","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eThree-dimensional Integrated Circuit Design\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003e\u003ci\u003eOvercome Interconnect Bottleneck at the new frontier of Integrated Circuit Design: 3-Dimensions!\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eVasilis F. Pavlidis (Author), Eby G. Friedman (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780123743435\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 31 October 2008\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e336 pages\u003cbr\u003e23.4 x 19 x 2.2 cm, 0.85 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eWith vastly increased complexity and functionality in the \"nanometer era\" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eChapter 1. Introduction  Chapter 2. Manufacturing of 3-D Packaged SystemsChapter 3. 3-D Integrated Circuit Fabrication Technologies Chapter 4. Interconnect Prediction Models Chapter 5. Physical Design Techniques for 3-D ICsChapter 6. Thermal Management Techniques Chapter 7. Timing Optimization for Two-Terminal Interconnects Chapter 8. Timing Optimization for Multi-Terminal Interconnects Appendix A: Enumeration of Gate Pairs in a 3-D IC Appendix B: Formal Proof of Optimum Single Via Placement Appendix C: Proof of the Two-Terminal Via Placement HeuristicAppendix D: Proof of Condition for Via Placement of Multi-Terminal Nets References\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Technical design [\u003ca title=\"See our other books on Technical design\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Technical%20design%20%5BTBD%5D%22\"\u003eTBD\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Freshly Printed Books","offers":[{"title":"Default Title","offer_id":46649289802008,"sku":"9780123743435","price":45.59,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9780123743435.jpg?v=1695013884","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/three-dimensional-integrated-circuit-design-paperback-9780123743435","provider":"Freshly Printed Books","version":"1.0","type":"link"}