{"product_id":"principles-of-plasma-discharges-and-materials-processing-hardback-9781394245376","title":"Principles of Plasma Discharges and Materials Processing (Hardback) 9781394245376","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003ePrinciples of Plasma Discharges and Materials Processing\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cfont size=\"4\"\u003eMichael A. Lieberman (Author), Allan J. Lichtenberg (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781394245376, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 16 August 2024\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e832 pages\u003cbr\u003e25.6 x 18.8 x 4.8 cm, 1.315 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e\u003cb\u003eA new edition of this industry classic on the principles of plasma processing\u003c\/b\u003e \u003c\/p\u003e\n\u003cp\u003ePlasma-based technology and materials processes have been central to the revolution of the last half-century in micro- and nano-electronics. From anisotropic plasma etching on microprocessors, memory, and analog chips, to plasma deposition for creating solar panels and flat-panel displays, plasma-based materials processes have reached huge areas of technology. As key technologies scale down in size from the nano- to the atomic level, further developments in plasma materials processing will only become more essential. \u003c\/p\u003e\n\u003cp\u003e\u003ci\u003ePrinciples of Plasma Discharges and Materials Processing\u003c\/i\u003e is the foundational introduction to the subject. It offers detailed information and procedures for designing plasma-based equipment and analyzing plasma-based processes, with an emphasis on the abiding fundamentals. Now fully updated to reflect the latest research and data, it promises to continue as an indispensable resource for graduate students and industry professionals in a myriad of technological fields. \u003c\/p\u003e\n\u003cp\u003eReaders of the third edition of \u003ci\u003ePrinciples of Plasma Discharges and Materials Processing\u003c\/i\u003e will also find: \u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eExtensive figures and tables to facilitate understanding\u003c\/li\u003e \u003cli\u003eA new chapter covering the recent development of processes involving high-pressure capacitive discharges\u003c\/li\u003e \u003cli\u003eNew subsections on discharge and processing chemistry, physics, and diagnostics\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003e\u003ci\u003ePrinciples of Plasma Discharges and Materials Processing \u003c\/i\u003eis ideal for professionals and process engineers in the field of plasma-assisted materials processing with experience in the field of science or engineering. It is the premiere world-wide basic text for graduate courses in the field.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003eList of Figures xxi\u003c\/p\u003e \u003cp\u003eList of Tables xlv\u003c\/p\u003e \u003cp\u003ePreface to Third Edition xlvii\u003c\/p\u003e \u003cp\u003ePreface to Second Edition xlix\u003c\/p\u003e \u003cp\u003ePreface to the First Edition li\u003c\/p\u003e \u003cp\u003eSymbols, Abbreviations, and Acronyms Iv\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Materials Processing 1\u003c\/p\u003e \u003cp\u003e1.2 Plasmas and Sheaths 5\u003c\/p\u003e \u003cp\u003e1.3 Discharges 12\u003c\/p\u003e \u003cp\u003e1.4 Symbols and Units 20\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Basic Plasma Equations and Equilibrium 21\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 21\u003c\/p\u003e \u003cp\u003e2.2 Field Equations, Current, and Voltage 22\u003c\/p\u003e \u003cp\u003e2.3 The Conservation Equations 25\u003c\/p\u003e \u003cp\u003e2.4 Equilibrium Properties 30\u003c\/p\u003e \u003cp\u003eProblems 34\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Atomic Collisions 37\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Basic Concepts 37\u003c\/p\u003e \u003cp\u003e3.2 Collision Dynamics 42\u003c\/p\u003e \u003cp\u003e3.3 Elastic Scattering 46\u003c\/p\u003e \u003cp\u003e3.4 Inelastic Collisions 53\u003c\/p\u003e \u003cp\u003e3.5 Averaging Over Distributions and Surface Effects 64\u003c\/p\u003e \u003cp\u003eProblems 68\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Plasma Dynamics 73\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Basic Motions 73\u003c\/p\u003e \u003cp\u003e4.2 Nonmagnetized Plasma Dynamics 77\u003c\/p\u003e \u003cp\u003e4.3 Guiding Center Motion 84\u003c\/p\u003e \u003cp\u003e4.4 Dynamics of Magnetized Plasmas 90\u003c\/p\u003e \u003cp\u003e4.5 Waves in Magnetized Plasmas 93\u003c\/p\u003e \u003cp\u003e4.6 Microwave and RF Field Diagnostics 100\u003c\/p\u003e \u003cp\u003eProblems 107\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Diffusion and Transport 111\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Basic Relations 111\u003c\/p\u003e \u003cp\u003e5.2 Diffusion Solutions 113\u003c\/p\u003e \u003cp\u003e5.3 Low-Pressure Solutions 119\u003c\/p\u003e \u003cp\u003e5.4 Diffusion Across a Magnetic Field 123\u003c\/p\u003e \u003cp\u003e5.5 Magnetic Multipole Confinement 129\u003c\/p\u003e \u003cp\u003eProblems 133\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 dc Sheaths 137\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Basic Concepts and Equations 137\u003c\/p\u003e \u003cp\u003e6.2 The Bohm Sheath Criterion 139\u003c\/p\u003e \u003cp\u003e6.3 The High-Voltage Sheath 145\u003c\/p\u003e \u003cp\u003e6.4 Generalized Criteria for Sheath Formation 147\u003c\/p\u003e \u003cp\u003e6.5 High-Voltage Collisional Sheaths 152\u003c\/p\u003e \u003cp\u003e6.6 Electrostatic Probe Diagnostics 153\u003c\/p\u003e \u003cp\u003eProblems 167\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Chemical Reactions and Equilibrium 171\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 171\u003c\/p\u003e \u003cp\u003e7.2 Energy and Enthalpy 172\u003c\/p\u003e \u003cp\u003e7.3 Entropy and Gibbs Free Energy 179\u003c\/p\u003e \u003cp\u003e7.4 Chemical Equilibrium 184\u003c\/p\u003e \u003cp\u003e7.5 Heterogeneous Equilibrium 187\u003c\/p\u003e \u003cp\u003eProblems 191\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Molecular Collisions 195\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 195\u003c\/p\u003e \u003cp\u003e8.2 Molecular Structure 195\u003c\/p\u003e \u003cp\u003e8.3 Electron Collisions with Molecules 202\u003c\/p\u003e \u003cp\u003e8.4 Heavy-Particle Collisions 211\u003c\/p\u003e \u003cp\u003e8.5 Reaction Rates and Detailed Balancing 221\u003c\/p\u003e \u003cp\u003e8.6 Optical Emission and Actinometry 229\u003c\/p\u003e \u003cp\u003eProblems 237\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Chemical Kinetics and Surface Processes 243\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Elementary Reactions 243\u003c\/p\u003e \u003cp\u003e9.2 Gas-Phase Kinetics 246\u003c\/p\u003e \u003cp\u003e9.3 Surface Processes 253\u003c\/p\u003e \u003cp\u003e9.4 Surface Kinetics 263\u003c\/p\u003e \u003cp\u003e9.5 Showerhead Gas Flow 270\u003c\/p\u003e \u003cp\u003eProblems 273\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Particle and Energy Balance in Discharges 279\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 279\u003c\/p\u003e \u003cp\u003e10.2 Electropositive Plasma Equilibrium 281\u003c\/p\u003e \u003cp\u003e10.3 Electronegative Plasma Equilibrium 289\u003c\/p\u003e \u003cp\u003e10.4 Approximate Electronegative Equilibria 297\u003c\/p\u003e \u003cp\u003e10.5 Electronegative Discharge Experiments and Simulations 304\u003c\/p\u003e \u003cp\u003e10.6 Pulsed Discharges 313\u003c\/p\u003e \u003cp\u003eProblems 324\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Low-Pressure Capacitive Discharges 329\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 Homogeneous Model 330\u003c\/p\u003e \u003cp\u003e11.2 Inhomogeneous Model 340\u003c\/p\u003e \u003cp\u003e11.3 Experiments and Simulations 353\u003c\/p\u003e \u003cp\u003e11.4 Asymmetric Discharges 365\u003c\/p\u003e \u003cp\u003e11.5 Voltage-Driven Sheaths and Series Resonance 369\u003c\/p\u003e \u003cp\u003e11.6 Multi-frequency Capacitive Discharges 372\u003c\/p\u003e \u003cp\u003e11.7 Standing Wave and Skin Effects 383\u003c\/p\u003e \u003cp\u003e11.8 Low-Frequency Sheaths 391\u003c\/p\u003e \u003cp\u003e11.9 Ion-Bombarding Energy at Electrodes 394\u003c\/p\u003e \u003cp\u003e11.10 Magnetically Enhanced Discharges 401\u003c\/p\u003e \u003cp\u003e11.11 Matching Networks and Power Measurements 406\u003c\/p\u003e \u003cp\u003eProblems 410\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Inductive Discharges 415\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 High-Density, Low-Pressure Discharges 415\u003c\/p\u003e \u003cp\u003e12.2 Other Operating Regimes 422\u003c\/p\u003e \u003cp\u003e12.3 Planar Coil Configuration 430\u003c\/p\u003e \u003cp\u003e12.4 High-Efficiency Planar Discharges 436\u003c\/p\u003e \u003cp\u003eProblems 441\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Wave-Heated Discharges 445\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 Electron Cyclotron Resonance Discharges 445\u003c\/p\u003e \u003cp\u003e13.2 Helicon Discharges 464\u003c\/p\u003e \u003cp\u003e13.3 Surface Wave Discharges 473\u003c\/p\u003e \u003cp\u003eProblems 477\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 dc Discharges 479\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e14.1 Qualitative Characteristics of Glow Discharges 479\u003c\/p\u003e \u003cp\u003e14.2 Analysis of the Positive Column 482\u003c\/p\u003e \u003cp\u003e14.3 Analysis of the Cathode Region 485\u003c\/p\u003e \u003cp\u003e14.4 Hollow Cathode Discharges 492\u003c\/p\u003e \u003cp\u003e14.5 Planar Magnetron Discharges 498\u003c\/p\u003e \u003cp\u003e14.6 Ionized Physical Vapor Deposition 507\u003c\/p\u003e \u003cp\u003eProblems 510\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 High-Pressure Capacitive Discharges 513\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e15.1 Introduction 513\u003c\/p\u003e \u003cp\u003e15.2 Intermediate Pressure RF Discharges 514\u003c\/p\u003e \u003cp\u003e15.3 Alpha-to-Gamma (α–γ) Transition 524\u003c\/p\u003e \u003cp\u003e15.4 Atmospheric Pressure RF Discharges 534\u003c\/p\u003e \u003cp\u003e15.5 Atmospheric Pressure Low-Frequency Discharges 548\u003c\/p\u003e \u003cp\u003eProblems 556\u003c\/p\u003e \u003cp\u003e\u003cb\u003e16 Etching 561\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e16.1 Etch Requirements and Processes 561\u003c\/p\u003e \u003cp\u003e16.2 Etching Kinetics 568\u003c\/p\u003e \u003cp\u003e16.3 Halogen Atom Etching of Silicon 575\u003c\/p\u003e \u003cp\u003e16.4 Other Etch Systems 588\u003c\/p\u003e \u003cp\u003e16.5 Atomic Layer Etching (ALE) 595\u003c\/p\u003e \u003cp\u003e16.6 Substrate Charging 608\u003c\/p\u003e \u003cp\u003eProblems 616\u003c\/p\u003e \u003cp\u003e\u003cb\u003e17 Deposition and Implantation 619\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e17.1 Introduction 619\u003c\/p\u003e \u003cp\u003e17.2 Plasma-Enhanced Chemical Vapor Deposition 621\u003c\/p\u003e \u003cp\u003e17.3 Atomic Layer Deposition 628\u003c\/p\u003e \u003cp\u003e17.4 Sputter Deposition 636\u003c\/p\u003e \u003cp\u003e17.5 Plasma-Immersion Ion Implantation 640\u003c\/p\u003e \u003cp\u003eProblems 651\u003c\/p\u003e \u003cp\u003e\u003cb\u003e18 Dusty Plasmas 655\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e18.1 Qualitative Description of Phenomena 655\u003c\/p\u003e \u003cp\u003e18.2 Particle Charging and Discharge Equilibrium 656\u003c\/p\u003e \u003cp\u003e18.3 Particulate Equilibrium 662\u003c\/p\u003e \u003cp\u003e18.4 Formation and Growth of Dust Grains 665\u003c\/p\u003e \u003cp\u003e18.5 Physical Phenomena and Diagnostics 670\u003c\/p\u003e \u003cp\u003e18.6 Removal or Production of Particulates 675\u003c\/p\u003e \u003cp\u003eProblems 677\u003c\/p\u003e \u003cp\u003e\u003cb\u003e19 Kinetic Theory of Discharges 681\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e19.1 Basic Concepts 681\u003c\/p\u003e \u003cp\u003e19.2 Local Kinetics 690\u003c\/p\u003e \u003cp\u003e19.3 Nonlocal Kinetics 693\u003c\/p\u003e \u003cp\u003e19.4 Quasilinear Diffusion and Stochastic Heating 697\u003c\/p\u003e \u003cp\u003e19.5 Energy Diffusion in a Skin Depth Layer 703\u003c\/p\u003e \u003cp\u003e19.6 Kinetic Modeling of Discharges 707\u003c\/p\u003e \u003cp\u003eProblems 714\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix A Collision Dynamics 717\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eA.1 Coulomb Cross Section 718\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix B The Collision Integral 721\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eB.1 Boltzmann Collision Integral 721\u003c\/p\u003e \u003cp\u003eB.2 Maxwellian Distribution 722\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix C Diffusion Solutions for Variable Mobility Model 723\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eReferences 727\u003c\/p\u003e \u003cp\u003eIndex 749\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley","offers":[{"title":"Brand New","offer_id":52173739753752,"sku":"9781394245376","price":81.59,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9781394245376.jpg?v=1781169296","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/principles-of-plasma-discharges-and-materials-processing-hardback-9781394245376","provider":"Freshly Printed Books","version":"1.0","type":"link"}