{"product_id":"modeling-analysis-design-and-tests-for-electronics-packaging-beyond-moore-paperback-9780081025321","title":"Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Paperback \/ softback) 9780081025321","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eModeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003e\u003cp\u003eProvides an overview of modeling and analysis techniques for predicting and evaluating electrical, thermal and mechanical performance in 2.5 and 3D packaging\u003c\/p\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eHengyun Zhang (Author), Faxing Che (Author), Tingyu Lin (Author), Wensheng Zhao (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780081025321, Elsevier Science\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 15 November 2019\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e434 pages\u003cbr\u003e22.9 x 15.1 x 2.7 cm, 0.7 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e\u003ci\u003eModeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore\u003c\/i\u003e provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D\/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e1. Introduction\u003cbr\u003e2. Electrical modeling and design\u003cbr\u003e3. Thermal modeling, analysis, and design \u003cbr\u003e4. Stress and reliability analysis for interconnects \u003cbr\u003e5. Reliability and failure analysis of encapsulated packages \u003cbr\u003e6. Thermal and mechanical tests for packages and materials\u003cbr\u003e7. System-level modeling, analysis, and design\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronic devices \u0026amp; materials [\u003ca title=\"See our other books on Electronic devices \u0026amp; materials\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronic%20devices%20\u0026amp;%20materials%20%5BTJFD%5D%22\"\u003eTJFD\u003c\/a\u003e], Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e], Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Woodhead Publishing","offers":[{"title":"Default Title","offer_id":46649166102808,"sku":"9780081025321","price":122.79,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9780081025321_75522464-963f-4fb6-8cad-00d00d936eb6.jpg?v=1695006448","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/modeling-analysis-design-and-tests-for-electronics-packaging-beyond-moore-paperback-9780081025321","provider":"Freshly Printed Books","version":"1.0","type":"link"}