{"product_id":"micromechanics-and-mems-classic-and-seminal-papers-to-1990-paperback-softback-9780780310858","title":"Micromechanics and MEMS; Classic and Seminal Papers to 1990 (Paperback \/ softback) 9780780310858","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eMicromechanics and MEMS\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eClassic and Seminal Papers to 1990\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eWilliam S. Trimmer (Edited by), WS Trimmer (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780780310858, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 15 January 1997\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e728 pages\u003cbr\u003e28.8 x 22.2 x 4.4 cm, 1.996 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eMicromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eAcknowledgments and Dedication.  \u003cp\u003eIntroduction.\u003c\/p\u003e \u003cp\u003eComments on Writing an Article.\u003c\/p\u003e \u003cp\u003eEARLY PAPERS IN MICROMECHANICS.\u003c\/p\u003e \u003cp\u003eThere's Plenty of Room at the Bottom (R. Feynman).\u003c\/p\u003e \u003cp\u003eInfinitesimal Machinery (R. Feynman).\u003c\/p\u003e \u003cp\u003eThe Resonant Gate Transistor (H. Nathanson, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSilicon Micromechanical Devices (J. Angell, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eAnisotropic Etching of Silicon (K. Bean).\u003c\/p\u003e \u003cp\u003eSilicon as a Mechanical Materials (K. Petersen).\u003c\/p\u003e \u003cp\u003eMicrorobots and Micromechanical Systems (W. Trimmer).\u003c\/p\u003e \u003cp\u003eSmall Machines, Large Opportunities (K. Gabriel, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSIDE DRIVE ACTUATORS.\u003c\/p\u003e \u003cp\u003eIC-Processed Electrostatic Micro-Motors (L.-S. Fan, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e\u003ci\u003eIC\u003c\/i\u003e-Processed Micro-Motors: Design, Technology, and Testing (Y.-C. Tai, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSurface-Micromachining Processes for Electrostatic Microactuator Fabrication (T. Lober and R. Howe).\u003c\/p\u003e \u003cp\u003eA Study of Three Microfabricated Variable-Capacitance Motors (M. Mehregany, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eFriction and Wear in Microfabricated Harmonic Side-Drive Motors (M. Mehregany, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMeasurements of Electric Micromotor Dynamics (S. Bart, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eCOMB DRIVE ACTUATORS.\u003c\/p\u003e \u003cp\u003eLaterally Driven Polysilicon Resonant Microstructures (W. Tang, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eElectrostatic-Comb Drive of Lateral Polysilicon Resonators (W. Tang, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eElectrostatically Balanced Comb Drive for Controlled Levitation (W. Tang, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003ePolysilicon Microgripper (C.-J. Kim, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eELECTROSTATIC ACTUATORS.\u003c\/p\u003e \u003cp\u003eThe Principle of an Electrostatic Linear Actuator Manufactured by Silicon Micromachining (H. Fujita and A. Omodaka).\u003c\/p\u003e \u003cp\u003eDesign Considerations for a Practical Electrostatic Micro-Motor (W. Trimmer and K. Gabriel).\u003c\/p\u003e \u003cp\u003eSCOFSS: A Small Cantilevered Optical Fiber Servo System (J. Wood, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMicroactuators for Aligning Optical Fibers (R. Jebens, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eLarge Displacement Linear Actuator (R. Brennen, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMulti-Layered Electrostatic Film Actuator (S. Egawa and T. Higuchi).\u003c\/p\u003e \u003cp\u003eMovable Micromachined Silicon Plates With Integrated Position Sensing (M. Allen, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMicro Electro Static Actuator With Three Degrees of Freedom (T. Fukuda and T. Tanaka).\u003c\/p\u003e \u003cp\u003eThe Modelling of Electrostatic Forces in Small Electrostatic Actuators (R. Price. \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSilicon Electrostatic Motors (W. Trimmer, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eElectrostatic Actuators for Micromechatronics (H. Fujita and A. Omodaka).\u003c\/p\u003e \u003cp\u003eElectric Micromotors: Electromechanical Characteristics (J. Lang, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eElectroquasistatic Induction Micromotors (S. Bart and J. Lang)\u003c\/p\u003e \u003cp\u003eA Perturbation Method for Calculating the Capacitance of Electrostatic Motors (S. Kumar and D. Cho)\u003c\/p\u003e \u003cp\u003eMAGNETIC ACTUATORS.\u003c\/p\u003e \u003cp\u003eMagnetically Levitated Micro-Machines (R. Pelrine and I. Busch-Vishniac).\u003c\/p\u003e \u003cp\u003eFabrication and Testing of a Micro Superconducting Actuator Using the Meissner Effect (Y.-K. Kim, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eRoom Temperature, Open-Loop Levitation of Microdevices Using Diamagnetic Materials (R. Pelrine).\u003c\/p\u003e \u003cp\u003eHARMONIC MOTORS.\u003c\/p\u003e \u003cp\u003eAn Operational Harmonic Electrostatic Motor (W. Trimmer and R. Jebens).\u003c\/p\u003e \u003cp\u003eThe Wobble Motor: An Electrostatic Planetary-Armature, Microactuator (S. Jacobsen, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eAn Electrostatic Top Motor and Its Characteristics (M. Sakata, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eOperation of Microfabricated Harmonic and Ordinary Side-Drive Motors (M. Mehregany, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eOTHER ACTUATORS.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThermal.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eMicromechanical Silicon Actuators Based on Thermal Expansion Effects (W. Riethmüller, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eCMOS Electrothermal Microactuators (M. Parameswaran, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eElectrically-Activated, Micromachined Diaphragm Valves (H. Jerman).\u003c\/p\u003e \u003cp\u003eStudy on Micro Engines—Miniaturizing Stirling Engines for Actuators and Heatpumps (N. Nakajima, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eShape Memory Alloy.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eA Micro Rotary Actuator Using Shape Memory Alloys (K. Gabriel, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMillimeter Size Joint Actuator Using Shape Memory Alloy (K. Kuribayashi).\u003c\/p\u003e \u003cp\u003eReversible SMA Actuator for Micron Sized Robot (K. Kuribayashi \u0026amp; M. Yoshitake).\u003c\/p\u003e \u003cp\u003eCharacteristics of Thin-Wire Shape Memory Actuators (P. Neukomm, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eShape Memory Alloy Microactuators (M. Bergamasco, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eImpact,\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eMicro Actuators Using Recoil of an Ejected Mass (T. Higuchi, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003ePrecise Positioning Mechanism Utilizing Rapid Deformations of Piezoelectric Elements (T. Higuchi, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eTiny Silent Linear Cybernetic Actuator Driven by Piezoelectric Device With Electromagnetic Clamp (K. Ikuta, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eExperimental Model and IC-Process Design of a Nanometer Linear Piezoelectric Stepper Motor (J. Judy, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePiezoelectric.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eZinc-Oxide Thin Films for Integrated-Sensor Applications (D. Polla \u0026amp; R. Muller).\u003c\/p\u003e \u003cp\u003eA Micromachined Manipulator for Submicron Positioning of Optical Fibers (A. Feury, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eUltrasonic Micromotors: Physics and Applications (R. Moroney, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eVALVES AND PUMPS.\u003c\/p\u003e \u003cp\u003eA Microminiature Electric-to-Fluidic Valve (M. Zdeblick \u0026amp; J. Angell).\u003c\/p\u003e \u003cp\u003eThe Fabrication of Integrated Mass Flow Controllers (M. Esashi, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eNormally Close Microvalve and Micropump Fabricated on a Silicon Wafer (M. Esashi, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eA Thermopneumatic Micropump Based on Micro-Engineering Techniques (F. Van de Pol, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eVariable-Flow Micro-Valve Structure Fabricated with Silicon Fusion Bonding (F. Pourahmadi, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eA Pressure-Balanced Electrostatically-Actuated Microvalve (M. Huff, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMicromachined Silicon Microvalve (T. Ohnstein, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eFLUIDICS.\u003c\/p\u003e \u003cp\u003eMicrominiature Fluidic Amplifier (M. Zdeblick, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eA Planar Air Levitated Electrostatic Actuator System (K. Pister, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eLiquid and Gas Transport in Small Channels (J. Pfahler, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSqueeze-Film Damping in Solid-State Accelerometers (J. Starr).\u003c\/p\u003e \u003cp\u003eA Micromachined Floating-Element Shear Sensor (M. Schmidt, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eA Multi-Element Monolithic Mass Flowmeter with On-Chip CMOS Readout Electronics (E. Yoon \u0026amp; K. Wise).\u003c\/p\u003e \u003cp\u003eEnvironmentally Rugged, Wide Dynamic Range Microstructure Airflow Sensor (T. Ohnstein, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSURFACE MICROMACHINING.\u003c\/p\u003e \u003cp\u003ePolycrystalline Silicon Micromechanical Beams (R. Howe \u0026amp; R. Muller).\u003c\/p\u003e \u003cp\u003eIntegrate Fabrication of Polysilicon Mechanisms (M. Mehregany, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eIntegrated Movable MicroMechanical Structures for Sensors and Actuators (L.-S. Fan, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003ePolysilicon Microbridge Fabrication Using Standard CMOS Technology (M. Parameswaran, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eProcess Integration for Active Polysilicon Resonant Microstructures (M. Putty, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eFabrication of Micromechanical Devices From Polysilicon Films With Smooth Surfaces (H. Guckel, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSelective Chemical Vapor Deposition of Tungsten for Microelectromechanical Structures (N. MacDonald, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eBULK MICROMACHINING.\u003c\/p\u003e \u003cp\u003eFabrication of Hemispherical Structures Using Semiconductor Technology for Use in Thermonuclear Fusion Research (K. Wise, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMicromachining of Silicon Mechanical Structures (G. Kaminsky).\u003c\/p\u003e \u003cp\u003eStrings, Loops, and Pyramids—Building Blocks for Microstructrures (H. Busta, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eCorner Compensation Structures for (110) Oriented Silicon (D. Ciarlo).\u003c\/p\u003e \u003cp\u003eA Study on Compensating Corner Undercutting in Anisotropic Etching of (100) Silicon (X.-P. Wu \u0026amp; W. Ko).\u003c\/p\u003e \u003cp\u003eA New Silicon-on-Glass Process for Integrated Sensors (L. Spangler and K. Wise).\u003c\/p\u003e \u003cp\u003eMechanisms of Anodic Bonding of Silicon to Pyrex\u003csup\u003e®\u003c\/sup\u003e Glass (K. Albaugh, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSilicon Fusion Bonding for Pressure Sensors (K. Petersen, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eLow-Temperature Silicon-to-silicon Anodic Bonding With Intermediate Low Melting Point Glass (M. Esashi, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eFusing Silicon Wafers With Low Melting Temperature Glass (L. Field \u0026amp; R. Muller).\u003c\/p\u003e \u003cp\u003eSilicon Fusion Bonding for Fabrication of Sensors, Actuators and Microstructures (P. Barth).\u003c\/p\u003e \u003cp\u003eScaling and Dielectric Stress Compensation of Ultrasensitive Boron-Doped Silicon Microstructures (S. Cho, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eField Oxide Microbridges, Cantilever Beams, Coils and Suspended Membranes in SACMOS Technology (D. Moser, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMicromachining of Quartz and its Application to an Acceleration Sensor (J. Daniel, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eLIGA.\u003c\/p\u003e \u003cp\u003eFabrication of Microstructures using the LIGA Process (W. Ehrfeld, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eDeep X-Ray and UV Lithographies for Micromechanics (H. Guckel, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eCOMPUTER AIDED DESIGN.\u003c\/p\u003e \u003cp\u003eOYSTER, a 3D Structural Simulator for Micro Electromechanical Design (G. Koppelman).\u003c\/p\u003e \u003cp\u003eA CAD Architecture for Microelectromechanical Systems (F. Maseeh, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eCAEMEMS: An Integrated \u003cb\u003eC\u003c\/b\u003eomputer-\u003cb\u003eA\u003c\/b\u003eided \u003cb\u003eE\u003c\/b\u003engineering Workbench for \u003cb\u003eM\u003c\/b\u003eicro-\u003cb\u003eE\u003c\/b\u003electro-\u003cb\u003eM\u003c\/b\u003eechanical \u003cb\u003eS\u003c\/b\u003eystems (S. Crary and Y. Zhang).\u003c\/p\u003e \u003cp\u003eCAD for Silicon Anistropic Etching (R. Buser and N. de Rooij).\u003c\/p\u003e \u003cp\u003eMETROLOGY.\u003c\/p\u003e \u003cp\u003eCan We Design Microbotic Devices Without Knowing the Mechanical Properties of Materials? (S. Senturia).\u003c\/p\u003e \u003cp\u003eThe Use of Micromachined Structure for the Measurement of Mechanical Properties and Adhesion of Thin Films (M. Mehregany, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eMechanical Property Measurement of Thin Films Using Load-Deflection of Composite Rectangular Membrane (O. Tabata, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eFracture Toughness Characterization of Brittle Thin Films (L. Fan, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eSpiral Microstructures for the Measurement of Average Strain Gradients in Thin Films (L.-S. Fan, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003ePolysilicon Microstructures to Characterize Static Friction (M. Lim, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eStudy of the Dynamic Force\/Acceleration Measurement (A. Umeda and K. Ueda).\u003c\/p\u003e \u003cp\u003eAnomalous Emissivity from Periodic Micro Machined Silicon Surfaces (P. Hesketh, \u003ci\u003eet al.\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003eAuthor Index.\u003c\/p\u003e \u003cp\u003eSubject Index.\u003c\/p\u003e \u003cp\u003eAbout the Author.\u003c\/p\u003e \u003cp\u003eEditor's Notes on the Second Printing.\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Brand New","offer_id":52407345611032,"sku":"9780780310858","price":161.99,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780780310858.jpg?v=1784163941","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/micromechanics-and-mems-classic-and-seminal-papers-to-1990-paperback-softback-9780780310858","provider":"Freshly Printed Books","version":"1.0","type":"link"}