{"product_id":"mems-and-microsystems-design-manufacture-and-nanoscale-engineering-hardback-9780470083017","title":"MEMS and Microsystems; Design, Manufacture, and Nanoscale Engineering (Hardback) 9780470083017","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eMEMS and Microsystems\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eDesign, Manufacture, and Nanoscale Engineering\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eTai-Ran Hsu (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780470083017, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 29 April 2008\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e576 pages\u003cbr\u003e23.6 x 19.3 x 3.8 cm, 1.089 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eAktuell und didaktisch ausgereift, bietet der Band Anwendern und fortgeschrittenen Studierenden einen ausgezeichneten Zugang zu den Themenbereichen MEMS und Mikrosysteme. Berücksichtigt werden sowohl Aspekte der Elektrik und Elektronik als auch die mechanische Seite der MEMS.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003ePreface xvii\u003c\/p\u003e \u003cp\u003ePreface To The First Edition xix\u003c\/p\u003e \u003cp\u003eSuggestions To Instructors xxiii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 OVERVIEW OF MEMS AND MICROSYSTEMS 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 MEMS and Microsystems 1\u003c\/p\u003e \u003cp\u003e1.2 Typical MEMS and Microsystems Products 7\u003c\/p\u003e \u003cp\u003e1.2.1 Microgears 7\u003c\/p\u003e \u003cp\u003e1.2.2 Micromotors 7\u003c\/p\u003e \u003cp\u003e1.2.3 Microturbines 7\u003c\/p\u003e \u003cp\u003e1.2.4 Micro-Optical Components 7\u003c\/p\u003e \u003cp\u003e1.3 Evolution of Microfabrication 10\u003c\/p\u003e \u003cp\u003e1.4 Microsystems and Microelectronics 11\u003c\/p\u003e \u003cp\u003e1.5 Multidisciplinary Nature of Microsystems Design and Manufacture 13\u003c\/p\u003e \u003cp\u003e1.6 Microsystems and Miniaturization 15\u003c\/p\u003e \u003cp\u003e1.7 Application of Microsystems in Automotive Industry 21\u003c\/p\u003e \u003cp\u003e1.7.1 Safety 22\u003c\/p\u003e \u003cp\u003e1.7.2 Engine and Power Trains 24\u003c\/p\u003e \u003cp\u003e1.7.3 Comfort and Convenience 24\u003c\/p\u003e \u003cp\u003e1.7.4 Vehicle Diagnostics and Health Monitoring 24\u003c\/p\u003e \u003cp\u003e1.7.5 Future Automotive Applications 26\u003c\/p\u003e \u003cp\u003e1.8 Application of Microsystems in Other Industries 27\u003c\/p\u003e \u003cp\u003e1.8.1 Application in Health Care Industry 27\u003c\/p\u003e \u003cp\u003e1.8.2 Application in Aerospace Industry 28\u003c\/p\u003e \u003cp\u003e1.8.3 Application in Industrial Products 29\u003c\/p\u003e \u003cp\u003e1.8.4 Application in Consumer Products 29\u003c\/p\u003e \u003cp\u003e1.8.5 Application in Telecommunications 30\u003c\/p\u003e \u003cp\u003e1.9 Markets for Microsystems 30\u003c\/p\u003e \u003cp\u003eProblems 32\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 WORKING PRINCIPLES OF MICROSYSTEMS 35\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 35\u003c\/p\u003e \u003cp\u003e2.2 Microsensors 35\u003c\/p\u003e \u003cp\u003e2.2.1 Acoustic Wave Sensors 36\u003c\/p\u003e \u003cp\u003e2.2.2 Biomedical and Biosensors 37\u003c\/p\u003e \u003cp\u003e2.2.3 Chemical Sensors 40\u003c\/p\u003e \u003cp\u003e2.2.4 Optical Sensors 42\u003c\/p\u003e \u003cp\u003e2.2.5 Pressure Sensors 44\u003c\/p\u003e \u003cp\u003e2.2.6 Thermal Sensors 50\u003c\/p\u003e \u003cp\u003e2.3 Microactuation 53\u003c\/p\u003e \u003cp\u003e2.3.1 Actuation Using Thermal Forces 53\u003c\/p\u003e \u003cp\u003e2.3.2 Actuation Using Shape Memory Alloys 54\u003c\/p\u003e \u003cp\u003e2.3.3 Actuation Using Piezoelectric Effect 54\u003c\/p\u003e \u003cp\u003e2.3.4 Actuation Using Electrostatic Forces 55\u003c\/p\u003e \u003cp\u003e2.4 MEMS with Microactuators 59\u003c\/p\u003e \u003cp\u003e2.4.1 Microgrippers 59\u003c\/p\u003e \u003cp\u003e2.4.2 Miniature Microphones 61\u003c\/p\u003e \u003cp\u003e2.4.3 Micromotors 64\u003c\/p\u003e \u003cp\u003e2.5 Microactuators with Mechanical Inertia 66\u003c\/p\u003e \u003cp\u003e2.5.1 Microaccelerometers 66\u003c\/p\u003e \u003cp\u003e2.5.2 Microgyroscopes 70\u003c\/p\u003e \u003cp\u003e2.6 Microfluidics 72\u003c\/p\u003e \u003cp\u003e2.6.1 Microvalves 74\u003c\/p\u003e \u003cp\u003e2.6.2 Micropumps 75\u003c\/p\u003e \u003cp\u003e2.6.3 Micro–Heat Pipes 75\u003c\/p\u003e \u003cp\u003eProblems 77\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 ENGINEERING SCIENCE FOR MICROSYSTEMS DESIGN AND FABRICATION 83\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 83\u003c\/p\u003e \u003cp\u003e3.2 Atomic Structure of Matter 83\u003c\/p\u003e \u003cp\u003e3.3 Ions and Ionization 86\u003c\/p\u003e \u003cp\u003e3.4 Molecular Theory of Matter and Intermolecular Forces 87\u003c\/p\u003e \u003cp\u003e3.5 Doping of Semiconductors 89\u003c\/p\u003e \u003cp\u003e3.6 Diffusion Process 92\u003c\/p\u003e \u003cp\u003e3.7 Plasma Physics 99\u003c\/p\u003e \u003cp\u003e3.8 Electrochemistry 100\u003c\/p\u003e \u003cp\u003e3.8.1 Electrolysis 101\u003c\/p\u003e \u003cp\u003e3.8.2 Electrohydrodynamics 102\u003c\/p\u003e \u003cp\u003eProblems 105\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 ENGINEERING MECHANICS FOR MICROSYSTEMS DESIGN 109\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 109\u003c\/p\u003e \u003cp\u003e4.2 Static Bending of Thin Plates 110\u003c\/p\u003e \u003cp\u003e4.2.1 Bending of Circular Plates with Edge Fixed 112\u003c\/p\u003e \u003cp\u003e4.2.2 Bending of Rectangular Plates with All Edges Fixed 114\u003c\/p\u003e \u003cp\u003e4.2.3 Bending of Square Plates with Edges Fixed 116\u003c\/p\u003e \u003cp\u003e4.3 Mechanical Vibration 119\u003c\/p\u003e \u003cp\u003e4.3.1 General Formulation 119\u003c\/p\u003e \u003cp\u003e4.3.2 Resonant Vibration 123\u003c\/p\u003e \u003cp\u003e4.3.3 Microaccelerometers 125\u003c\/p\u003e \u003cp\u003e4.3.4 Design Theory of Accelerometers 126\u003c\/p\u003e \u003cp\u003e4.3.5 Damping Coefficients 134\u003c\/p\u003e \u003cp\u003e4.3.6 Resonant Microsensors 144\u003c\/p\u003e \u003cp\u003e4.4 Thermomechanics 150\u003c\/p\u003e \u003cp\u003e4.4.1 Thermal Effects on Mechanical Strength of Materials 150\u003c\/p\u003e \u003cp\u003e4.4.2 Creep Deformation 150\u003c\/p\u003e \u003cp\u003e4.4.3 Thermal Stresses 152\u003c\/p\u003e \u003cp\u003e4.5 Fracture Mechanics 165\u003c\/p\u003e \u003cp\u003e4.5.1 Stress Intensity Factors 166\u003c\/p\u003e \u003cp\u003e4.5.2 Fracture Toughness 167\u003c\/p\u003e \u003cp\u003e4.5.3 Interfacial Fracture Mechanics 169\u003c\/p\u003e \u003cp\u003e4.6 Thin-Film Mechanics 172\u003c\/p\u003e \u003cp\u003e4.7 Overview of Finite Element Stress Analysis 173\u003c\/p\u003e \u003cp\u003e4.7.1 The Principle 173\u003c\/p\u003e \u003cp\u003e4.7.2 Engineering Applications 175\u003c\/p\u003e \u003cp\u003e4.7.3 Input Information to FEA 175\u003c\/p\u003e \u003cp\u003e4.7.4 Output from FEA 175\u003c\/p\u003e \u003cp\u003e4.7.5 Graphical Output 176\u003c\/p\u003e \u003cp\u003e4.7.6 General Remarks 176\u003c\/p\u003e \u003cp\u003eProblems 178\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 THERMOFLUID ENGINEERING AND MICROSYSTEMS DESIGN 183\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction 183\u003c\/p\u003e \u003cp\u003e5.2 Overview of Basics of Fluid Mechanics at Macro- and Mesoscales 184\u003c\/p\u003e \u003cp\u003e5.2.1 Viscosity of Fluids 184\u003c\/p\u003e \u003cp\u003e5.2.2 Streamlines and Stream Tubes 186\u003c\/p\u003e \u003cp\u003e5.2.3 Control Volumes and Control Surfaces 187\u003c\/p\u003e \u003cp\u003e5.2.4 Flow Patterns and Reynolds Number 187\u003c\/p\u003e \u003cp\u003e5.3 Basic Equations in Continuum Fluid Dynamics 187\u003c\/p\u003e \u003cp\u003e5.3.1 Continuity Equation 187\u003c\/p\u003e \u003cp\u003e5.3.2 Momentum Equation 190\u003c\/p\u003e \u003cp\u003e5.3.3 Equation of Motion 192\u003c\/p\u003e \u003cp\u003e5.4 Laminar Fluid Flow in Circular Conduits 195\u003c\/p\u003e \u003cp\u003e5.5 Computational Fluid Dynamics 198\u003c\/p\u003e \u003cp\u003e5.6 Incompressible Fluid Flow in Microconduits 199\u003c\/p\u003e \u003cp\u003e5.6.1 Surface Tension 199\u003c\/p\u003e \u003cp\u003e5.6.2 Capillary Effect 201\u003c\/p\u003e \u003cp\u003e5.6.3 Micropumping 203\u003c\/p\u003e \u003cp\u003e5.7 Overview of Heat Conduction in Solids 204\u003c\/p\u003e \u003cp\u003e5.7.1 General Principle of Heat Conduction 204\u003c\/p\u003e \u003cp\u003e5.7.2 Fourier Law of Heat Conduction 205\u003c\/p\u003e \u003cp\u003e5.7.3 Heat Conduction Equation 207\u003c\/p\u003e \u003cp\u003e5.7.4 Newton’s Cooling Law 208\u003c\/p\u003e \u003cp\u003e5.7.5 Solid–Fluid Interaction 209\u003c\/p\u003e \u003cp\u003e5.7.6 Boundary Conditions 210\u003c\/p\u003e \u003cp\u003e5.8 Heat Conduction in Multilayered Thin Films 215\u003c\/p\u003e \u003cp\u003e5.9 Heat Conduction in Solids at Submicrometer Scale 220\u003c\/p\u003e \u003cp\u003eProblems 221\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 SCALING LAWS IN MINIATURIZATION 227\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction to Scaling 227\u003c\/p\u003e \u003cp\u003e6.2 Scaling in Geometry 228\u003c\/p\u003e \u003cp\u003e6.3 Scaling in Rigid-Body Dynamics 230\u003c\/p\u003e \u003cp\u003e6.3.1 Scaling in Dynamic Forces 230\u003c\/p\u003e \u003cp\u003e6.3.2 Trimmer Force Scaling Vector 231\u003c\/p\u003e \u003cp\u003e6.4 Scaling in Electrostatic Forces 233\u003c\/p\u003e \u003cp\u003e6.5 Scaling of Electromagnetic Forces 235\u003c\/p\u003e \u003cp\u003e6.6 Scaling in Electricity 237\u003c\/p\u003e \u003cp\u003e6.7 Scaling in Fluid Mechanics 238\u003c\/p\u003e \u003cp\u003e6.8 Scaling in Heat Transfer 242\u003c\/p\u003e \u003cp\u003e6.8.1 Scaling in Heat Conduction 242\u003c\/p\u003e \u003cp\u003e6.8.2 Scaling in Heat Convection 243\u003c\/p\u003e \u003cp\u003eProblems 244\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 MATERIALS FOR MEMS AND MICROSYSTEMS 245\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 245\u003c\/p\u003e \u003cp\u003e7.2 Substrates and Wafers 245\u003c\/p\u003e \u003cp\u003e7.3 Active Substrate Materials 247\u003c\/p\u003e \u003cp\u003e7.4 Silicon as Substrate Material 247\u003c\/p\u003e \u003cp\u003e7.4.1 Ideal Substrate for MEMS 247\u003c\/p\u003e \u003cp\u003e7.4.2 Single-Crystal Silicon and Wafers 248\u003c\/p\u003e \u003cp\u003e7.4.3 Crystal Structure 250\u003c\/p\u003e \u003cp\u003e7.4.4 Miller Indices 253\u003c\/p\u003e \u003cp\u003e7.4.5 Mechanical Properties of Silicon 256\u003c\/p\u003e \u003cp\u003e7.5 Silicon Compounds 258\u003c\/p\u003e \u003cp\u003e7.5.1 Silicon Dioxide 258\u003c\/p\u003e \u003cp\u003e7.5.2 Silicon Carbide 259\u003c\/p\u003e \u003cp\u003e7.5.3 Silicon Nitride 259\u003c\/p\u003e \u003cp\u003e7.5.4 Polycrystalline Silicon 260\u003c\/p\u003e \u003cp\u003e7.6 Silicon Piezoresistors 261\u003c\/p\u003e \u003cp\u003e7.7 Gallium Arsenide 266\u003c\/p\u003e \u003cp\u003e7.8 Quartz 267\u003c\/p\u003e \u003cp\u003e7.9 Piezoelectric Crystals 268\u003c\/p\u003e \u003cp\u003e7.10 Polymers 274\u003c\/p\u003e \u003cp\u003e7.10.1 Polymers as Industrial Materials 274\u003c\/p\u003e \u003cp\u003e7.10.2 Polymers for MEMS and Microsystems 275\u003c\/p\u003e \u003cp\u003e7.10.3 Conductive Polymers 275\u003c\/p\u003e \u003cp\u003e7.10.4 Langmuir–Blodgett Film 277\u003c\/p\u003e \u003cp\u003e7.10.5 SU-8 Photoresists 278\u003c\/p\u003e \u003cp\u003e7.11 Packaging Materials 280\u003c\/p\u003e \u003cp\u003eProblems 281 \u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 MICROSYSTEMS FABRICATION PROCESSES 285\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 285\u003c\/p\u003e \u003cp\u003e8.2 Photolithography 285\u003c\/p\u003e \u003cp\u003e8.2.1 Overview 286\u003c\/p\u003e \u003cp\u003e8.2.2 Photoresists and Application 286\u003c\/p\u003e \u003cp\u003e8.2.3 Light Sources 288\u003c\/p\u003e \u003cp\u003e8.2.4 Photoresist Development 289\u003c\/p\u003e \u003cp\u003e8.2.5 Photoresist Removal and Postbaking 289\u003c\/p\u003e \u003cp\u003e8.3 Ion Implantation 289\u003c\/p\u003e \u003cp\u003e8.4 Diffusion 292\u003c\/p\u003e \u003cp\u003e8.5 Oxidation 295\u003c\/p\u003e \u003cp\u003e8.5.1 Thermal Oxidation 295\u003c\/p\u003e \u003cp\u003e8.5.2 Silicon Dioxide 296\u003c\/p\u003e \u003cp\u003e8.5.3 Thermal Oxidation Rates 296\u003c\/p\u003e \u003cp\u003e8.5.4 Oxide Thickness by Color 300\u003c\/p\u003e \u003cp\u003e8.6 Chemical Vapor Deposition 301\u003c\/p\u003e \u003cp\u003e8.6.1 Working Principle of CVD 301\u003c\/p\u003e \u003cp\u003e8.6.2 Chemical Reactions in CVD 302\u003c\/p\u003e \u003cp\u003e8.6.3 Rate of Deposition 303\u003c\/p\u003e \u003cp\u003e8.6.4 Enhanced CVD 310\u003c\/p\u003e \u003cp\u003e8.7 Physical Vapor Deposition: Sputtering 312\u003c\/p\u003e \u003cp\u003e8.8 Deposition by Epitaxy 313\u003c\/p\u003e \u003cp\u003e8.9 Etching 315\u003c\/p\u003e \u003cp\u003e8.9.1 Chemical Etching 316\u003c\/p\u003e \u003cp\u003e8.9.2 Plasma Etching 317\u003c\/p\u003e \u003cp\u003e8.10 Summary of Microfabrication 317\u003c\/p\u003e \u003cp\u003eProblems 318\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 OVERVIEW OF MICROMANUFACTURING 323\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 323\u003c\/p\u003e \u003cp\u003e9.2 Bulk Micromanufacturing 324\u003c\/p\u003e \u003cp\u003e9.2.1 Overview of Etching 324\u003c\/p\u003e \u003cp\u003e9.2.2 Isotropic and Anisotropic Etching 325\u003c\/p\u003e \u003cp\u003e9.2.3 Wet Etchants 326\u003c\/p\u003e \u003cp\u003e9.2.4 Etch Stop 328\u003c\/p\u003e \u003cp\u003e9.2.5 Dry Etching 329\u003c\/p\u003e \u003cp\u003e9.2.6 Comparison of Wet versus Dry Etching 333\u003c\/p\u003e \u003cp\u003e9.3 Surface Micromachining 333\u003c\/p\u003e \u003cp\u003e9.3.1 Description 333\u003c\/p\u003e \u003cp\u003e9.3.2 Process 335\u003c\/p\u003e \u003cp\u003e9.3.3 Mechanical Problems Associated with Surface Micromachining 336\u003c\/p\u003e \u003cp\u003e9.4 LIGA Process 338\u003c\/p\u003e \u003cp\u003e9.4.1 Description 339\u003c\/p\u003e \u003cp\u003e9.4.2 Materials for Substrates and Photoresists 340\u003c\/p\u003e \u003cp\u003e9.4.3 Electroplating 341\u003c\/p\u003e \u003cp\u003e9.4.4 SLIGA Process 342\u003c\/p\u003e \u003cp\u003e9.5 Summary of Micromanufacturing 343\u003c\/p\u003e \u003cp\u003e9.5.1 Bulk Micromanufacturing 343\u003c\/p\u003e \u003cp\u003e9.5.2 Surface Micromachining 343\u003c\/p\u003e \u003cp\u003e9.5.3 LIGA Process 343\u003c\/p\u003e \u003cp\u003eProblems 344\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 MICROSYSTEMS DESIGN 349\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 349\u003c\/p\u003e \u003cp\u003e10.2 Design Considerations 350\u003c\/p\u003e \u003cp\u003e10.2.1 Design Constraints 351\u003c\/p\u003e \u003cp\u003e10.2.2 Selection of Materials 352\u003c\/p\u003e \u003cp\u003e10.2.3 Selection of Manufacturing Processes 354\u003c\/p\u003e \u003cp\u003e10.2.4 Selection of Signal Transduction 355\u003c\/p\u003e \u003cp\u003e10.2.5 Electromechanical System 358\u003c\/p\u003e \u003cp\u003e10.2.6 Packaging 358\u003c\/p\u003e \u003cp\u003e10.3 Process Design 358\u003c\/p\u003e \u003cp\u003e10.3.1 Photolithography 359\u003c\/p\u003e \u003cp\u003e10.3.2 Thin-Film Fabrications 360\u003c\/p\u003e \u003cp\u003e10.3.3 Geometry Shaping 362\u003c\/p\u003e \u003cp\u003e10.4 Mechanical Design 362\u003c\/p\u003e \u003cp\u003e10.4.1 Geometry of MEMS Components 362\u003c\/p\u003e \u003cp\u003e10.4.2 Thermomechanical Loading 362\u003c\/p\u003e \u003cp\u003e10.4.3 Thermomechanical Stress Analysis 363\u003c\/p\u003e \u003cp\u003e10.4.4 Dynamic Analysis 364\u003c\/p\u003e \u003cp\u003e10.4.5 Interfacial Fracture Analysis 369\u003c\/p\u003e \u003cp\u003e10.5 Mechanical Design Using Finite Element Method 369\u003c\/p\u003e \u003cp\u003e10.5.1 Finite Element Formulation 370\u003c\/p\u003e \u003cp\u003e10.5.2 Simulation of Microfabrication Processes 375\u003c\/p\u003e \u003cp\u003e10.6 Design of Silicon Die of a Micropressure Sensor 378\u003c\/p\u003e \u003cp\u003e10.7 Design of Microfluidic Network Systems 382\u003c\/p\u003e \u003cp\u003e10.7.1 Fluid Resistance in Microchannels 383\u003c\/p\u003e \u003cp\u003e10.7.2 Capillary Electrophoresis Network Systems 386\u003c\/p\u003e \u003cp\u003e10.7.3 Mathematical Modeling of Capillary Electrophoresis Network Systems 388\u003c\/p\u003e \u003cp\u003e10.7.4 Design Case: Capillary Electrophoresis Network System 389\u003c\/p\u003e \u003cp\u003e10.7.5 Capillary Electrophoresis in Curved Channels 392\u003c\/p\u003e \u003cp\u003e10.7.6 Issues in Design of CE Processes 394\u003c\/p\u003e \u003cp\u003e10.8 Computer-Aided Design 395\u003c\/p\u003e \u003cp\u003e10.8.1 Why CAD? 395\u003c\/p\u003e \u003cp\u003e10.8.2 What Is in a CAD Package for Microsystems? 395\u003c\/p\u003e \u003cp\u003e10.8.3 How to Choose a CAD Package 398\u003c\/p\u003e \u003cp\u003e10.8.4 Design Case Using CAD 398\u003c\/p\u003e \u003cp\u003eProblems 402\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 ASSEMBLY, PACKAGING, AND TESTING OF MICROSYSTEMS 407\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 407\u003c\/p\u003e \u003cp\u003e11.2 Overview of Microassembly 409\u003c\/p\u003e \u003cp\u003e11.3 High Costs of Microassembly 410\u003c\/p\u003e \u003cp\u003e11.4 Microassembly Processes 411\u003c\/p\u003e \u003cp\u003e11.5 Major Technical Problems in Microassembly 413\u003c\/p\u003e \u003cp\u003e11.5.1 Tolerances in Microassembly 414\u003c\/p\u003e \u003cp\u003e11.5.2 Tools and Fixtures 417\u003c\/p\u003e \u003cp\u003e11.5.3 Contact Problems in Microassembly Tools 417\u003c\/p\u003e \u003cp\u003e11.6 Microassembly Work Cells 419\u003c\/p\u003e \u003cp\u003e11.7 Challenging Issues in Microassembly 421\u003c\/p\u003e \u003cp\u003e11.8 Overview of Microsystems Packaging 422\u003c\/p\u003e \u003cp\u003e11.9 General Considerations in Packaging Design 424\u003c\/p\u003e \u003cp\u003e11.10 Three Levels of Microsystems Packaging 424\u003c\/p\u003e \u003cp\u003e11.10.1 Die-Level Packaging 424\u003c\/p\u003e \u003cp\u003e11.10.2 Device-Level Packaging 425\u003c\/p\u003e \u003cp\u003e11.10.3 System-Level Packaging 427\u003c\/p\u003e \u003cp\u003e11.11 Interfaces in Microsystems Packaging 427\u003c\/p\u003e \u003cp\u003e11.12 Essential Packaging Technologies 428\u003c\/p\u003e \u003cp\u003e11.13 Die Preparation 429\u003c\/p\u003e \u003cp\u003e11.14 Surface Bonding 429\u003c\/p\u003e \u003cp\u003e11.14.1 Adhesives 430\u003c\/p\u003e \u003cp\u003e11.14.2 Eutectic Bonding 431\u003c\/p\u003e \u003cp\u003e11.14.3 Anodic Bonding 432\u003c\/p\u003e \u003cp\u003e11.14.4 Silicon Fusion Bonding 434\u003c\/p\u003e \u003cp\u003e11.14.5 Overview of Surface Bonding Techniques 434\u003c\/p\u003e \u003cp\u003e11.14.6 Silicon-on-Insulator: Special Surface Bonding Techniques 435\u003c\/p\u003e \u003cp\u003e11.15 Wire Bonding 437\u003c\/p\u003e \u003cp\u003e11.16 Sealing and Encapsulation 439\u003c\/p\u003e \u003cp\u003e11.16.1 Integrated Encapsulation Processes 440\u003c\/p\u003e \u003cp\u003e11.16.2 Sealing by Wafer Bonding 441\u003c\/p\u003e \u003cp\u003e11.16.3 Vacuum Sealing and Encapsulation 442\u003c\/p\u003e \u003cp\u003e11.17 Three-Dimensional Packaging 443\u003c\/p\u003e \u003cp\u003e11.18 Selection of Packaging Materials 444\u003c\/p\u003e \u003cp\u003e11.19 Signal Mapping and Transduction 447\u003c\/p\u003e \u003cp\u003e11.19.1 Typical Electrical Signals in Microsystems 447\u003c\/p\u003e \u003cp\u003e11.19.2 Measurement of Resistance 447\u003c\/p\u003e \u003cp\u003e11.19.3 Signal Mapping and Transduction in Pressure Sensors 448\u003c\/p\u003e \u003cp\u003e11.19.4 Capacitance Measurements 450\u003c\/p\u003e \u003cp\u003e11.20 Design Case on Pressure Sensor Packaging 451\u003c\/p\u003e \u003cp\u003e11.21 Reliability in MEMS Packaging 455\u003c\/p\u003e \u003cp\u003e11.22 Testing for Reliability 456\u003c\/p\u003e \u003cp\u003eProblems 458\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 INTRODUCTION TO NANOSCALE ENGINEERING 465\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 465\u003c\/p\u003e \u003cp\u003e12.2 Micro- and Nanoscale Technologies 467\u003c\/p\u003e \u003cp\u003e12.3 General Principle of Nanofabrication 468\u003c\/p\u003e \u003cp\u003e12.4 Nanoproducts 471\u003c\/p\u003e \u003cp\u003e12.5 Application of Nanoproducts 474\u003c\/p\u003e \u003cp\u003e12.6 Quantum Physics 478\u003c\/p\u003e \u003cp\u003e12.7 Molecular Dynamics 479\u003c\/p\u003e \u003cp\u003e12.8 Fluid Flow in Submicrometer- and Nanoscales 482\u003c\/p\u003e \u003cp\u003e12.8.1 Rarefied Gas 482\u003c\/p\u003e \u003cp\u003e12.8.2 Knudsen and Mach Numbers 482\u003c\/p\u003e \u003cp\u003e12.8.3 Modeling of Micro- and Nanoscale Gas Flow 483\u003c\/p\u003e \u003cp\u003e12.9 Heat Conduction at Nanoscale 486\u003c\/p\u003e \u003cp\u003e12.9.1 Heat Transmission at Submicrometer- and Nanoscale 486\u003c\/p\u003e \u003cp\u003e12.9.2 Thermal Conductivity of Thin Films 489\u003c\/p\u003e \u003cp\u003e12.9.3 Heat Conduction Equation for Thin Films 490\u003c\/p\u003e \u003cp\u003e12.10 Measurement of Thermal Conductivity 491\u003c\/p\u003e \u003cp\u003e12.11 Challenges in Nanoscale Engineering 497\u003c\/p\u003e \u003cp\u003e12.11.1 Nanopatterning in Nanofabrication 498\u003c\/p\u003e \u003cp\u003e12.11.2 Nanoassembly 500\u003c\/p\u003e \u003cp\u003e12.11.3 New Materials for Nanoelectromechanical Systems (NEMS) 500\u003c\/p\u003e \u003cp\u003e12.11.4 Analytical Modeling 501\u003c\/p\u003e \u003cp\u003e12.11.5 Testing 502\u003c\/p\u003e \u003cp\u003e12.12 Social Impacts of Nanoscale Engineering 502\u003c\/p\u003e \u003cp\u003eProblems 503\u003c\/p\u003e \u003cp\u003eReferences 509\u003c\/p\u003e \u003cp\u003eAppendix 1 Recommended Units For Thermophysical Quantities 523\u003c\/p\u003e \u003cp\u003eAppendix 2 Conversion Of Units 525\u003c\/p\u003e \u003cp\u003eIndex 527\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Mechanical engineering \u0026amp; materials [\u003ca title=\"See our other books on Mechanical engineering \u0026amp; materials\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Mechanical%20engineering%20\u0026amp;%20materials%20%5BTG%5D%22\"\u003eTG\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley","offers":[{"title":"Brand New","offer_id":52256974864664,"sku":"9780470083017","price":114.26,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780470083017.jpg?v=1781275579","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/mems-and-microsystems-design-manufacture-and-nanoscale-engineering-hardback-9780470083017","provider":"Freshly Printed Books","version":"1.0","type":"link"}