{"product_id":"materials-processes-and-reliability-for-advanced-interconnects-for-micro-and-nanoelectronics-2009-volume-1156-paperback-9781107408319","title":"Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009: Volume 1156 (Paperback \/ softback) 9781107408319","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eMaterials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009: Volume 1156\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eMartin Gall (Edited by), Alfred Grill (Edited by), Francesca Lacopi (Edited by), Junichi Koike (Edited by), Takamasa Usui (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781107408319, Cambridge University Press\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 5 June 2014\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e204 pages\u003cbr\u003e22.9 x 15.2 x 1.1 cm, 0.28 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eEnabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePart I. Low-k Dielectrics I\u003cbr\u003e Part II. Low-k Dielectrics II\u003cbr\u003e Part III. Poster Session: Interconnects\u003cbr\u003e Part IV. Metalization I\u003cbr\u003e Part V. Metallization II\u003cbr\u003e Part VI. Reliability\u003cbr\u003e Part VII. Emerging Interconnect Technologies\u003cbr\u003e Part VIII. Joint Session: Interconnect and Packaging\u003cbr\u003e Author index\u003cbr\u003e Subject index.\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Cambridge University Press","offers":[{"title":"Default Title","offer_id":46265697075480,"sku":"9781107408319","price":25.79,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9781107408319i.jpg?v=1694485113","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/materials-processes-and-reliability-for-advanced-interconnects-for-micro-and-nanoelectronics-2009-volume-1156-paperback-9781107408319","provider":"Freshly Printed Books","version":"1.0","type":"link"}