{"product_id":"materials-and-devices-for-end-of-roadmap-and-beyond-cmos-scaling-volume-1252-hardback-9781605112299","title":"Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling: Volume 1252 (Hardback) 9781605112299","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eMaterials and Devices for End-of-Roadmap and Beyond CMOS Scaling: Volume 1252\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eShriram Ramanathan (Edited by), Supratik Guha (Edited by), Jochen Mannhart (Edited by), Andrew C. Kummel (Edited by), Heiji Watanabe (Edited by), Iain Thayne (Edited by), Prashant Majhi (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781605112299, Cambridge University Press\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 27 December 2010\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e0 pages\u003cbr\u003e23.5 x 16 x 1.5 cm, 0.4 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eThis proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 5–9 at the 2010 MRS Spring Meeting in San Francisco, California. These symposia attracted 106 presentations, of which twenty-two were invited. Historically, scaling in Si CMOS was primarily led by lithography. In the last decade, this situation has been completely revolutionized with the introduction of the likes of copper interconnects, high-k gate dielectrics, metal gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were reduced beyond 45 nm. As we look towards the end of the roadmap and beyond, the proliferation of potential solutions to meet the necessary performance challenges becomes truly staggering, and has motivated an exponential increase in research in a wide range of emerging materials and devices architectures.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePart I. Novel Devices\u003cbr\u003e Part II. Ge MOSFET\u003cbr\u003e Part III. Poster Session\u003cbr\u003e Part IV. III-V MOSFET\u003cbr\u003e Part V. Novel Devices and III-V MOSFET\u003cbr\u003e Part VI. Materials and Devices for beyond CMOS Scaling\u003cbr\u003e Author index\u003cbr\u003e Subject index.\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Cambridge University Press","offers":[{"title":"Default Title","offer_id":46266508869912,"sku":"9781605112299","price":73.79,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9781605112299i.jpg?v=1694708087","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/materials-and-devices-for-end-of-roadmap-and-beyond-cmos-scaling-volume-1252-hardback-9781605112299","provider":"Freshly Printed Books","version":"1.0","type":"link"}