{"product_id":"integrated-passive-component-technology-hardback-9780471244318","title":"Integrated Passive Component Technology (Hardback) 9780471244318","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eIntegrated Passive Component Technology\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cfont size=\"4\"\u003eRichard K. Ulrich (Edited by), RK Ulrich (Author), Leonard W. Schaper (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780471244318, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 11 July 2003\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e400 pages\u003cbr\u003e24.5 x 16.2 x 2.4 cm, 0.683 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cem\u003e\u003cfont size=\"3\"\u003e\"…a comprehensive look at the reasons and current challenges…[of integrating] passive devices into board or IC…just the right dose of the math to explain the physics and theory behind the technology.\" (\u003ci\u003eIEEE Circuits \u0026amp; Devices Magazine\u003c\/i\u003e, Jan\/Feb 2005)  \u003cp\u003e\"...an interesting and useful book; I wholeheartedly recommend it.\"(Circuit World, Vol.30, No. 2003)\u003c\/p\u003e\u003c\/font\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cul\u003e \u003cli\u003eThis is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.\u003c\/li\u003e \u003cli\u003eDescribes the processes available for creating integrated passives, measuring their properties, and applying them.\u003c\/li\u003e \u003cli\u003eBrings reader up to date in a fast-moving technology.\u003c\/li\u003e \u003cli\u003eEnables reader to implement the technology into a manufacturing environment.\u003c\/li\u003e \u003cli\u003eCovers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.\u003c\/li\u003e \u003cli\u003eDescribes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.\u003c\/li\u003e \u003c\/ul\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eContributors.  \u003cp\u003ePreface.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e1.1 Status and Trends in Discrete Passive Components.\u003c\/p\u003e \u003cp\u003e1.2 Definitions and Configurations of Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.3 Comparison to Integrated Active Devices.\u003c\/p\u003e \u003cp\u003e1.4 Substrates and Interconnect Systems for Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.5 Fabrication of Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.6 Reasons for Integrating Passive Devices.\u003c\/p\u003e \u003cp\u003e1.7 Problems with Integrating Passive Devices.\u003c\/p\u003e \u003cp\u003e1.8 Applications for Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.9 The Past and Future of Integrated Passives.\u003c\/p\u003e \u003cp\u003e1.10 Organization of this Book.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Characteristics and Performance of Planar Resistors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e2.1 Performance Parameters.\u003c\/p\u003e \u003cp\u003e2.2 Resistance in Electronic Materials.\u003c\/p\u003e \u003cp\u003e2.3 Sizing Integrated Resistors.\u003c\/p\u003e \u003cp\u003e2.4 Trimming.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Integrated Resistor Materials and Processes\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e3.1 Single-Component Metals.\u003c\/p\u003e \u003cp\u003e3.2 Metal Alloys and Metal–Nonmetal Compounds.\u003c\/p\u003e \u003cp\u003e3.3 Semiconductors.\u003c\/p\u003e \u003cp\u003e3.4 Cermets.\u003c\/p\u003e \u003cp\u003e3.5 Polymer Thick Film.\u003c\/p\u003e \u003cp\u003e3.6 Ink Jet Deposition.\u003c\/p\u003e \u003cp\u003e3.7 Commercialized Processes.\u003c\/p\u003e \u003cp\u003e3.8 Summary.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Dielectric Materials for Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e4.1 Polarizability and Capacitance.\u003c\/p\u003e \u003cp\u003e4.2 Capacitance Density.\u003c\/p\u003e \u003cp\u003e4.3 Temperature Effects.\u003c\/p\u003e \u003cp\u003e4.4 Frequency and Voltage Effects.\u003c\/p\u003e \u003cp\u003e4.5 Aging Effects.\u003c\/p\u003e \u003cp\u003e4.6 Composition and Morphology Effects.\u003c\/p\u003e \u003cp\u003e4.7 Leakage and Breakdown.\u003c\/p\u003e \u003cp\u003e4.8 Dissipation Factor.\u003c\/p\u003e \u003cp\u003e4.9 Comparison to EIA Dielectric Classifications.\u003c\/p\u003e \u003cp\u003e4.10 Matching Dielectric Materials to Applications.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Size and Configuration of Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e5.1 Comparison of Integrated and Discrete Areas.\u003c\/p\u003e \u003cp\u003e5.2 Layout Options.\u003c\/p\u003e \u003cp\u003e5.3 Tolerance.\u003c\/p\u003e \u003cp\u003e5.4 Mixed Dielectric Strategies.\u003c\/p\u003e \u003cp\u003e5.5 CV Product.\u003c\/p\u003e \u003cp\u003e5.6 Maximum Capacitance Density and Breakdown Voltage.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Processing Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e6.1 Sputtering.\u003c\/p\u003e \u003cp\u003e6.2 CVD, PECVD and MOCVD.\u003c\/p\u003e \u003cp\u003e6.3 Anodization.\u003c\/p\u003e \u003cp\u003e6.4 Sol-Gel and Hydrothermal Ferroelectrics.\u003c\/p\u003e \u003cp\u003e6.5 Thin- and Thick-Film Polymers.\u003c\/p\u003e \u003cp\u003e6.6 Thick-Film Dielectrics.\u003c\/p\u003e \u003cp\u003e6.7 Interlayer Insulation.\u003c\/p\u003e \u003cp\u003e6.8 Interdigitated Capacitors.\u003c\/p\u003e \u003cp\u003e6.9 Capacitor Plate Materials.\u003c\/p\u003e \u003cp\u003e6.10 Trimming Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e6.11 Commercialized Integrated Capacitor Technologies.\u003c\/p\u003e \u003cp\u003e6.12 Summary.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Defects and Yield Issues\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e7.1 Causes of Fatal Defects in Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e7.2 Measurement of Defect Density.\u003c\/p\u003e \u003cp\u003e7.3 Defect Density and System Yield.\u003c\/p\u003e \u003cp\u003e7.3.1 Predicting Yield from Defect Density.\u003c\/p\u003e \u003cp\u003e7.4 Yield Enhancement Techniques for Capacitors.\u003c\/p\u003e \u003cp\u003e7.5 Conclusions.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Electrical Performance of Integrated Capacitors\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich and Leonard W. Schaper\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e8.1 Modeling Ideal Passives.\u003c\/p\u003e \u003cp\u003e8.2 Modeling Real Capacitors.\u003c\/p\u003e \u003cp\u003e8.3 Electrical Performance of Discrete and Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e8.4 Dissipation Factor of Real Capacitors.\u003c\/p\u003e \u003cp\u003e8.5 Measurement of Capacitor Properties.\u003c\/p\u003e \u003cp\u003e8.6 Summary.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Decoupling\u003c\/b\u003e (\u003ci\u003eLeonard W. Schaper\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e9.1 Power Distribution.\u003c\/p\u003e \u003cp\u003e9.2 Decoupling with Discrete Capacitors.\u003c\/p\u003e \u003cp\u003e9.3 Decoupling with Integrated Capacitors.\u003c\/p\u003e \u003cp\u003e9.4 Dielectrics and Configurations for Integrated Decoupling.\u003c\/p\u003e \u003cp\u003e9.5 Integrated Decoupling as an Entry Application.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Integrated Inductors\u003c\/b\u003e (\u003ci\u003eGeert J. Carchon and Walter De Raedt\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e10.1 Introduction.\u003c\/p\u003e \u003cp\u003e10.2 Inductor Behavior and Performance Parameters.\u003c\/p\u003e \u003cp\u003e10.3 Inductor Performance Prediction.\u003c\/p\u003e \u003cp\u003e10.4 Integrated Inductor Examples.\u003c\/p\u003e \u003cp\u003e10.5 Use of Inductors in Circuits: Examples.\u003c\/p\u003e \u003cp\u003e10.6 Conclusions.\u003c\/p\u003e \u003cp\u003eAcknowledgments.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Modeling of Integrated Inductors and Resistors for Microwave Applications\u003c\/b\u003e (\u003ci\u003eZhenwen Wang, M. Jamal Deen, and A. H. Rahal\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e11.1 Introduction.\u003c\/p\u003e \u003cp\u003e11.2 Modeling of Spiral Inductors.\u003c\/p\u003e \u003cp\u003e11.3 Modeling of Thin-Film Resistors.\u003c\/p\u003e \u003cp\u003e11.4 Conclusions.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003eAppendix: Characteristics of Microscript Lines.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Other Applications and Integration Technologies\u003c\/b\u003e (\u003ci\u003eElizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e12.1 Demonstration Devices Fabricated with Integrated Passives.\u003c\/p\u003e \u003cp\u003e12.2 Commercialized Thin-Film Build-Up Integrated Passives.\u003c\/p\u003e \u003cp\u003e12.3 Other Integrated Passive Technologies.\u003c\/p\u003e \u003cp\u003e12.4 Summary.\u003c\/p\u003e \u003cp\u003eAcknowledgments.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 The Economics of Embedded Passives\u003c\/b\u003e (\u003ci\u003ePeter A. Sandborn\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e13.1 Introduction.\u003c\/p\u003e \u003cp\u003e13.2 Modeling Embedded Passive Economics.\u003c\/p\u003e \u003cp\u003e13.3 Key Aspects of Modeling Embedded Passive Costs.\u003c\/p\u003e \u003cp\u003e13.4 Example Case Studies.\u003c\/p\u003e \u003cp\u003e13.5 Summary.\u003c\/p\u003e \u003cp\u003eAcknowledgments.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 The Future of Integrated Passives\u003c\/b\u003e (\u003ci\u003eRichard K. Ulrich\u003c\/i\u003e).\u003c\/p\u003e \u003cp\u003e14.1 Status of Passive Integration.\u003c\/p\u003e \u003cp\u003e14.2 Issues for Implementation on Organic Substrates.\u003c\/p\u003e \u003cp\u003e14.3 Progress on Board-Level Implementation.\u003c\/p\u003e \u003cp\u003e14.4 Three Ways In for Organic Boards.\u003c\/p\u003e \u003cp\u003e14.5 Conclusion.\u003c\/p\u003e \u003cp\u003eIndex.\u003c\/p\u003e \u003cp\u003eAbout the Editors.\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Brand New","offer_id":52286344462616,"sku":"9780471244318","price":108.29,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780471244318.jpg?v=1781550206","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/integrated-passive-component-technology-hardback-9780471244318","provider":"Freshly Printed Books","version":"1.0","type":"link"}