{"product_id":"integrated-circuit-hybrid-and-multichip-module-package-design-guidelines-a-focus-on-reliability-hardback-9780471594468","title":"Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines; A Focus on Reliability (Hardback) 9780471594468","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eIntegrated Circuit, Hybrid, and Multichip Module Package Design Guidelines\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eA Focus on Reliability\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eMichael G. Pecht (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780471594468, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 16 March 1994\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e464 pages\u003cbr\u003e24.6 x 16.4 x 2.6 cm, 0.723 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cp\u003eCircuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.\u003c\/p\u003e \u003cp\u003eIts uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:\u003c\/p\u003e \u003cul\u003e \u003cli\u003eDefine realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost\u003c\/li\u003e \u003cli\u003eDefine the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data\u003c\/li\u003e \u003cli\u003eIdentify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures\u003c\/li\u003e \u003cli\u003eCharacterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved\u003c\/li\u003e \u003cli\u003eUse experiment, step-stress, and accelerated methods to ensure optimum design before production begins\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eDetailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eDesign for Reliability Concepts.\u003cbr\u003e \u003cbr\u003e Starting the Design Process.\u003cbr\u003e \u003cbr\u003e Substrates.\u003cbr\u003e \u003cbr\u003e Wire and Wirebonds.\u003cbr\u003e \u003cbr\u003e Tape Automated Bonding.\u003cbr\u003e \u003cbr\u003e Flip-Chip Bonding.\u003cbr\u003e \u003cbr\u003e Attachment.\u003cbr\u003e \u003cbr\u003e Case.\u003cbr\u003e \u003cbr\u003e Leads.\u003cbr\u003e \u003cbr\u003e Lead Seals.\u003cbr\u003e \u003cbr\u003e Lid Seal and Lid.\u003cbr\u003e \u003cbr\u003e Index.\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Mechanical engineering \u0026amp; materials [\u003ca title=\"See our other books on Mechanical engineering \u0026amp; materials\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Mechanical%20engineering%20\u0026amp;%20materials%20%5BTG%5D%22\"\u003eTG\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley-Interscience","offers":[{"title":"Brand New","offer_id":52298003874072,"sku":"9780471594468","price":142.49,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780471594468.jpg?v=1781730649","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/integrated-circuit-hybrid-and-multichip-module-package-design-guidelines-a-focus-on-reliability-hardback-9780471594468","provider":"Freshly Printed Books","version":"1.0","type":"link"}