{"product_id":"from-led-to-solid-state-lighting-principles-materials-packaging-characterization-and-applications-hardback-9781118881477","title":"From LED to Solid State Lighting; Principles, Materials, Packaging, Characterization, and Applications (Hardback) 9781118881477","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eFrom LED to Solid State Lighting\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003ePrinciples, Materials, Packaging, Characterization, and Applications\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eS. W. Ricky Lee (Author), Jeffery C. C. Lo (Author), Mian Tao (Author), Huaiyu Ye (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781118881477, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 18 October 2021\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e256 pages\u003cbr\u003e24.4 x 17 x 1.6 cm, 0.61 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cb\u003eFROM LED TO SOLID STATE LIGHTING\u003c\/b\u003e \u003cp\u003e\u003cb\u003eA comprehensive and practical reference complete with hands-on exercises and experimental data\u003c\/b\u003e \u003c\/p\u003e\n\u003cp\u003eIn \u003ci\u003eFrom LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications\u003c\/i\u003e, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. \u003c\/p\u003e\n\u003cp\u003eReaders will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. \u003c\/p\u003e\n\u003cp\u003eThis important book also includes: \u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eThorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips\u003c\/li\u003e \u003cli\u003ePractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization\u003c\/li\u003e \u003cli\u003eComprehensive explorations of board-level assembly and LED modules and optical and electrical characterization\u003c\/li\u003e \u003cli\u003eIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003ePerfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, \u003ci\u003eFrom LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications\u003c\/i\u003e is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003ePreface v\u003c\/p\u003e \u003cp\u003eAbout the Authors vii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 LEDs for Solid-State Lighting \u003c\/b\u003e\u003cb\u003e1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Introduction 1\u003c\/p\u003e \u003cp\u003e1.2 Evolution of Light Sources and Lighting Systems 1\u003c\/p\u003e \u003cp\u003e1.3 Historical Development of LEDs 6\u003c\/p\u003e \u003cp\u003e1.4 Implementation of White Light Illumination with an LED 8\u003c\/p\u003e \u003cp\u003e1.5 LEDs for General Lighting 10\u003c\/p\u003e \u003cp\u003eReferences 12\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Packaging of LED Chips \u003c\/b\u003e\u003cb\u003e15\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 15\u003c\/p\u003e \u003cp\u003e2.2 Overall Packaging Process and LED Package Types 16\u003c\/p\u003e \u003cp\u003e2.3 Chip Mounting and Interconnection 20\u003c\/p\u003e \u003cp\u003e2.4 Phosphor Coating and Dispensing Process 38\u003c\/p\u003e \u003cp\u003e2.5 Encapsulation and Molding Process 48\u003c\/p\u003e \u003cp\u003e2.6 Secondary Optics and Lens Design 50\u003c\/p\u003e \u003cp\u003eReferences 54\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Chip Scale and Wafer Level Packaging of LEDs \u003c\/b\u003e\u003cb\u003e61\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 61\u003c\/p\u003e \u003cp\u003e3.2 Chip Scale Packaging 63\u003c\/p\u003e \u003cp\u003e3.3 Enabling Technologies forWafer Level Packaging 66\u003c\/p\u003e \u003cp\u003e3.4 Designs and Structures of LED Wafer Level Packaging 91\u003c\/p\u003e \u003cp\u003e3.5 Processes of LED Wafer Level Packaging 96\u003c\/p\u003e \u003cp\u003eReferences 106\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Board Level Assemblies and LED Modules \u003c\/b\u003e\u003cb\u003e111\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 111\u003c\/p\u003e \u003cp\u003e4.2 Board Level Assembly Processes 112\u003c\/p\u003e \u003cp\u003e4.3 Chip-on-Board Assemblies 130\u003c\/p\u003e \u003cp\u003e4.4 LED Modules and Considerations 137\u003c\/p\u003e \u003cp\u003eReferences 141\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Optical, Electrical, and Thermal Performance \u003c\/b\u003e\u003cb\u003e145\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Evaluation of Optical Performance 145\u003c\/p\u003e \u003cp\u003e5.2 Power Supply and Efficiency 159\u003c\/p\u003e \u003cp\u003e5.3 Consideration of LED Thermal Performance 163\u003c\/p\u003e \u003cp\u003eReferences 172\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Reliability Engineering for LED Packaging \u003c\/b\u003e\u003cb\u003e175\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Concept of Reliability and Test Methods 175\u003c\/p\u003e \u003cp\u003e6.2 Failure Analysis and Life Assessment 181\u003c\/p\u003e \u003cp\u003e6.3 Design for Reliability 185\u003c\/p\u003e \u003cp\u003eReferences 187\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Emerging Applications of LEDs \u003c\/b\u003e\u003cb\u003e189\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 LEDs for Automotive Lighting 189\u003c\/p\u003e \u003cp\u003e7.2 Micro- and Mini-LED Display 194\u003c\/p\u003e \u003cp\u003e7.3 LED for Visible Light Communication 203\u003c\/p\u003e \u003cp\u003eReferences 208\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 LEDs Beyond Visible Light \u003c\/b\u003e\u003cb\u003e213\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 Applications of UV-LED 213\u003c\/p\u003e \u003cp\u003e8.2 Applications of IR-LEDs 225\u003c\/p\u003e \u003cp\u003e8.3 Future Outlook and Other Technology Trends 233\u003c\/p\u003e \u003cp\u003eReferences 235\u003c\/p\u003e \u003cp\u003eIndex 243\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley","offers":[{"title":"Brand New","offer_id":52421378212120,"sku":"9781118881477","price":80.36,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9781118881477.jpg?v=1784593491","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/from-led-to-solid-state-lighting-principles-materials-packaging-characterization-and-applications-hardback-9781118881477","provider":"Freshly Printed Books","version":"1.0","type":"link"}