{"product_id":"failure-analysis-a-practical-guide-for-manufacturers-of-electronic-components-and-systems-hardback-9780470748244","title":"Failure Analysis; A Practical Guide for Manufacturers of Electronic Components and Systems (Hardback) 9780470748244","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eFailure Analysis\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eA Practical Guide for Manufacturers of Electronic Components and Systems\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eMarius Bazu (Author), Titu Bajenescu (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780470748244, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 18 April 2011\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e352 pages\u003cbr\u003e25.2 x 17.8 x 2.4 cm, 0.744 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eFailure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal.  \u003cp\u003eReliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.\u003c\/p\u003e \u003cp\u003eInside you will find detailed coverage on:\u003c\/p\u003e \u003cul\u003e \u003cli\u003ea synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved\u003c\/li\u003e \u003cli\u003ethe reasons why failure analysis is an important tool for improving yield and reliability by corrective actions\u003c\/li\u003e \u003cli\u003ethe design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) \u003c\/li\u003e \u003cli\u003efailure analysis during fabrication, covering reliability monitoring, process monitors and package reliability \u003c\/li\u003e \u003cli\u003ereliability resting after fabrication, including reliability assessment at this stage and corrective actions \u003c\/li\u003e \u003cli\u003ea large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods\u003c\/li\u003e \u003cli\u003enew challenges in reliability testing, such as its use in microsystems and nanostructures\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSeries Editor’s Foreword.  \u003cp\u003eForeword by Dr. Craig Hillman.\u003c\/p\u003e \u003cp\u003eSeries Editor’s Preface.\u003c\/p\u003e \u003cp\u003ePreface.\u003c\/p\u003e \u003cp\u003eAbout the Authors.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1. The Three Goals of the Book.\u003c\/p\u003e \u003cp\u003e1.2. Historical Perspective\u003c\/p\u003e \u003cp\u003e1.3. Terminology.\u003c\/p\u003e \u003cp\u003e1.4. State of the Art and Future Trends.\u003c\/p\u003e \u003cp\u003e1.5. General Plan of the Book.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Failure Analysis - Why?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1. Eight Possible Applications.\u003c\/p\u003e \u003cp\u003e2.2. Forensic Engineering.\u003c\/p\u003e \u003cp\u003e2.3. Reliability Modeling.\u003c\/p\u003e \u003cp\u003e2.4. Reverse Engineering.\u003c\/p\u003e \u003cp\u003e2.5. Controlling Critical Input Variables.\u003c\/p\u003e \u003cp\u003e2.6. Design for Reliability.\u003c\/p\u003e \u003cp\u003e2.7. Process Improvement.\u003c\/p\u003e \u003cp\u003e2.8. Saving Money by Early Control.\u003c\/p\u003e \u003cp\u003e2.9. A Synergetic Approach.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Failure Analysis - When?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1. During Development Cycle.\u003c\/p\u003e \u003cp\u003e3.2. Preparing the Fabrication.\u003c\/p\u003e \u003cp\u003e3.3. FA during Fabrication.\u003c\/p\u003e \u003cp\u003e3.4. FA after Fabrication.\u003c\/p\u003e \u003cp\u003e3.5. FA during Operation or Storage.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Failure Analysis - How?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1. Procedures for failure analysis.\u003c\/p\u003e \u003cp\u003e4.2. Techniques for decapsulating the device and for sample preparation.\u003c\/p\u003e \u003cp\u003e4.3. Techniques for failure analysis.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5. Failure Analysis - What?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Failure Modes and Mechanisms at Various Process Steps.\u003c\/p\u003e \u003cp\u003e5.2 Failure Modes and Mechanisms of Passive Electronic Parts.\u003c\/p\u003e \u003cp\u003e5.3 Failure Modes and Mechanisms of Silicon Bipolar Technology.\u003c\/p\u003e \u003cp\u003e5.4 Failure Modes and Mechanisms of MOS Technology.\u003c\/p\u003e \u003cp\u003e5.5 Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies.\u003c\/p\u003e \u003cp\u003e5.6 Failure Modes and Mechanisms of Non-Silicon Technologies.\u003c\/p\u003e \u003cp\u003e5.7 Failure Modes and Mechanisms of Hybrid Technology.\u003c\/p\u003e \u003cp\u003e5.8 Failure Modes and Mechanisms of Microsystem Technologies.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Case Studies.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Case Study No. 1: Capacitors.\u003c\/p\u003e \u003cp\u003e6.2 Case Study No. 2: Bipolar Power Devices.\u003c\/p\u003e \u003cp\u003e6.3 Case Study No. 3: CMOS Devices.\u003c\/p\u003e \u003cp\u003e6.4 Case Study No. 4: MOS Field Effect Transistors.\u003c\/p\u003e \u003cp\u003e6.5 Case Study No. 5: Thin Film Transistors.\u003c\/p\u003e \u003cp\u003e6.6 Case Study No. 6: High Electron Mobility Transistors.\u003c\/p\u003e \u003cp\u003e6.7 Case Study No. 7: MEMS Resonators.\u003c\/p\u003e \u003cp\u003e6.8 Case Study No. 8: MEMS Micro-Cantilevers.\u003c\/p\u003e \u003cp\u003e6.9 Case Study No. 9: MEMS Switches.\u003c\/p\u003e \u003cp\u003e6.10 Case Study No. 10: Magnetic MEMS Switches.\u003c\/p\u003e \u003cp\u003e6.11 Case Study No. 11: Chip-Scale Packages.\u003c\/p\u003e \u003cp\u003e6.12 Case Study No. 12: Solder Joints.\u003c\/p\u003e \u003cp\u003e6.13 Conclusions.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7. Conclusions.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAcronyms.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eGlossary.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eIndex.\u003c\/b\u003e\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley","offers":[{"title":"Brand New","offer_id":52278026699032,"sku":"9780470748244","price":82.56,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780470748244.jpg?v=1781456414","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/failure-analysis-a-practical-guide-for-manufacturers-of-electronic-components-and-systems-hardback-9780470748244","provider":"Freshly Printed Books","version":"1.0","type":"link"}