{"product_id":"electroless-copper-and-nickel-phosphorus-plating-processing-characterisation-and-modelling-paperback-9780081014974","title":"Electroless Copper and Nickel-Phosphorus Plating; Processing, Characterisation and Modelling (Paperback \/ softback) 9780081014974","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eElectroless Copper and Nickel-Phosphorus Plating\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eProcessing, Characterisation and Modelling\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eW Sha (Author), Xiaomin Wu (Author), K G Keong (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780081014974\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 19 August 2016\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e304 pages\u003cbr\u003e23.3 x 15.6 x 2 cm, 0.43 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cem\u003e\u003cfont size=\"3\"\u003e\"The author's use of modelling brings a new level of fundamental understanding to the field.\" \u003cb\u003e--Materials World\u003c\/b\u003e\u003c\/font\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eUnlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e1. Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions  \u003cp\u003e\u003cb\u003ePart I: Electroless copper depositions\u003c\/b\u003e2. Surface morphology evolution of electroless copper deposits3. Cross-section of electroless copper deposits and the void fraction4. Crystal structure and surface residual stress of electroless copper deposits5. The atomic model of the diamond pyramid structure in electroless copper deposits6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits7. Adhesion strength of electroless copper deposit to epoxy board8. Electrical resistivity of electroless copper deposit9. Applications of electroless copper deposits\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePart II: Electroless nickel–phosphorus (Ni–P) depositions\u003c\/b\u003e10. Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content11. Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content12. Modelling the thermodynamics and kinetics of crystallisation of nickel–phosphorus (Ni–P) deposits13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits14. Hardness evolution of nickel–phosphorus (Ni–P) deposits with thermal processing15. Applications of electroless nickel–phosphorus (Ni–P) plating\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronic devices \u0026amp; materials [\u003ca title=\"See our other books on Electronic devices \u0026amp; materials\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronic%20devices%20\u0026amp;%20materials%20%5BTJFD%5D%22\"\u003eTJFD\u003c\/a\u003e], Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Freshly Printed Books","offers":[{"title":"Default Title","offer_id":46648871518488,"sku":"9780081014974","price":95.39,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9780081014974_b94e4a9c-b1cf-4c8e-8661-49dad81fe0c7.jpg?v=1695004227","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/electroless-copper-and-nickel-phosphorus-plating-processing-characterisation-and-modelling-paperback-9780081014974","provider":"Freshly Printed Books","version":"1.0","type":"link"}