{"product_id":"dielectric-films-for-advanced-microelectronics-hardback-9780470013601","title":"Dielectric Films for Advanced Microelectronics (Hardback) 9780470013601","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eDielectric Films for Advanced Microelectronics\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cfont size=\"4\"\u003eMikhail Baklanov (Edited by), MR Baklanov (Author), Karen Maex (Edited by), Martin Green (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780470013601, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 9 February 2007\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e512 pages\u003cbr\u003e25 x 17.6 x 3.4 cm, 1.106 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cem\u003e\u003cfont size=\"3\"\u003e\"The book is well organized and has excellent technical depth with recent state-of-the-art information. Researchers, graduate students, and those in industry working on finding new materials and processes for thin-film dielectric materials would find this book to be a valuable resource.\" (\u003ci\u003eIEEE Electrical Insulation Magazine\u003c\/i\u003e, March\/April 2009)\u003c\/font\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eThe topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials.  \u003cp\u003eThis book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSeries Preface.  \u003cp\u003e\u003cb\u003ePreface.\u003c\/b\u003e \u003ci\u003e(Mikhail Baklanov, Martin Green and Karen Maex)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1.\u003c\/b\u003e \u003cb\u003eLow and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition.\u003c\/b\u003e \u003ci\u003e(A. Grill)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2.\u003c\/b\u003e \u003cb\u003eSpin-On Dielectric Materials.\u003c\/b\u003e \u003ci\u003e(Geraud Dubois, Willi Volksen and Robert D. Miller)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3.Porosity of Low Dielectric Constant Materials.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3.1 Positron Annihilation Spectroscopy.\u003c\/b\u003e \u003ci\u003e(David W. Gidley, Hua-Gen Peng, and Richard Vallery).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3.2\u003c\/b\u003e\u003cb\u003eStructure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation.\u003c\/b\u003e \u003ci\u003e(Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3.3\u003c\/b\u003e \u003cb\u003eEllipsometric Porosimetry.\u003c\/b\u003e \u003ci\u003e(M. R. Baklanov).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4.\u003c\/b\u003e\u003cb\u003eMechanical and Transport Properties of Low-k Dielectrics.\u003c\/b\u003e \u003ci\u003e(J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5. Integration of low-k dielectric films in damascene processes.\u003c\/b\u003e \u003ci\u003e(R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and\u003c\/i\u003e \u003ci\u003eF. Iacopi)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application.\u003c\/b\u003e \u003ci\u003e(Yakov  Roizin  and Vladimir  Gritsenko).\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eHigh Dielectric constant Materials.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7.\u003c\/b\u003e \u003cb\u003eMaterial Engineering of High-k Gate Dielectrics.\u003c\/b\u003e \u003ci\u003e(Akira Toriumi and Koji Kita)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8. \u003ca id=\"_Toc115841319\" name=\"_Toc115841319\"\u003ePhysical Characterisation of ultra-thin high-k dielectric\u003c\/a\u003e.\u003c\/b\u003e \u003ci\u003e(T. Conard, H. Bender and W. Vandervorst)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9. Electrical Characterization of Advanced Gate Dielectrics.\u003c\/b\u003e \u003ci\u003e(Robin Degraeve,\u003c\/i\u003e \u003ci\u003eJurriaan Schmitz,\u003c\/i\u003e \u003ci\u003eLuigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003eMedium dielectric constant materials.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10.\u003c\/b\u003e \u003cb\u003eIntegration Issues of High-k Gate Dielectrics.\u003c\/b\u003e \u003ci\u003e(Yasuo Nara)\u003c\/i\u003e.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eDielectric films for interconnects (packaging).\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects.\u003c\/b\u003e \u003ci\u003e(Yi Li, C. P. Wong)\u003cb\u003e.\u003c\/b\u003e\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eIndex.\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Mechanical engineering \u0026amp; materials [\u003ca title=\"See our other books on Mechanical engineering \u0026amp; materials\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Mechanical%20engineering%20\u0026amp;%20materials%20%5BTG%5D%22\"\u003eTG\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley","offers":[{"title":"Brand New","offer_id":52255775949080,"sku":"9780470013601","price":161.69,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780470013601.jpg?v=1781274127","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/dielectric-films-for-advanced-microelectronics-hardback-9780470013601","provider":"Freshly Printed Books","version":"1.0","type":"link"}