{"product_id":"chemical-mechanical-polishing-fundamentals-and-challenges-volume-566-hardback-9781558994737","title":"Chemical-Mechanical Polishing – Fundamentals and Challenges: Volume 566 (Hardback) 9781558994737","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eChemical-Mechanical Polishing – Fundamentals and Challenges: Volume 566\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eS. V. Babu (Edited by), S. Danyluk (Edited by), M. Krishnan (Edited by), M. Tsujimura (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781558994737, Cambridge University Press\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 10 February 2000\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e281 pages\u003cbr\u003e23.4 x 15.7 x 2.3 cm, 0.591 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eChemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePart I. Overview and Oxide Polishing\u003cbr\u003e Part II. Pads and Related Issues\u003cbr\u003e Part III. Metal Polishing - W and AI\u003cbr\u003e Part IV. Copper Polishing and Related Issues\u003cbr\u003e Part V. CMP Modeling and Fluid Flow\u003cbr\u003e Part VI. Particle Adhesion and Post-polish Cleaning\u003cbr\u003e Author index\u003cbr\u003e Subject index.\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Semi-conductors \u0026amp; super-conductors [\u003ca title=\"See our other books on Semi-conductors \u0026amp; super-conductors\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Semi-conductors%20\u0026amp;%20super-conductors%20%5BTJFD5%5D%22\"\u003eTJFD5\u003c\/a\u003e], Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Cambridge University Press","offers":[{"title":"Default Title","offer_id":46266502447384,"sku":"9781558994737","price":30.29,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9781558994737i_f8f49332-72d5-45e6-b1fa-7a13b1606105.jpg?v=1696684070","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/chemical-mechanical-polishing-fundamentals-and-challenges-volume-566-hardback-9781558994737","provider":"Freshly Printed Books","version":"1.0","type":"link"}