{"product_id":"chemical-mechanical-polishing-2000-fundamentals-and-materials-issues-volume-613-paperback-9781107413146","title":"Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613 (Paperback \/ softback) 9781107413146","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eChemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eRajiv K. Singh (Edited by), Rajeev Bajaj (Edited by), Mansour Moinpour (Edited by), Marc Meuris (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781107413146, Cambridge University Press\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003ePaperback \/ softback, published 5 June 2014\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e176 pages\u003cbr\u003e22.9 x 15.2 x 1 cm, 0.24 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eChemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Materials science [\u003ca title=\"See our other books on Materials science\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Materials%20science%20%5BTGM%5D%22\"\u003eTGM\u003c\/a\u003e], Industrial chemistry \u0026amp; manufacturing technologies [\u003ca title=\"See our other books on Industrial chemistry \u0026amp; manufacturing technologies\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Industrial%20chemistry%20\u0026amp;%20manufacturing%20technologies%20%5BTD%5D%22\"\u003eTD\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Cambridge University Press","offers":[{"title":"Default Title","offer_id":46265701728536,"sku":"9781107413146","price":25.79,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/products\/9781107413146i.jpg?v=1694485949","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/chemical-mechanical-polishing-2000-fundamentals-and-materials-issues-volume-613-paperback-9781107413146","provider":"Freshly Printed Books","version":"1.0","type":"link"}