{"product_id":"artificial-plasmonics-for-vlsi-interconnects-bridging-the-gap-between-electronics-and-optics-hardback-9781394289950","title":"Artificial Plasmonics for VLSI Interconnects; Bridging the Gap between Electronics and Optics (Hardback) 9781394289950","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eArtificial Plasmonics for VLSI Interconnects\u003c\/font\u003e\u003cbr\u003e\r\n\u003cfont size=\"5\"\u003eBridging the Gap between Electronics and Optics\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\u003cp\u003e\u003cfont size=\"4\"\u003eSoumitra R. Joy (Author), Pinaki Mazumder (Author)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9781394289950, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 19 November 2025\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e304 pages\u003cbr\u003e28 x 19 x 2.4 cm, 0.68 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e\u003cb\u003eBuild the microchips of the future with this revolutionary new information transfer technology\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eAdvancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore’s Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.\u003c\/p\u003e \u003cp\u003e\u003ci\u003eArtificial Plasmonics for VLSI Interconnects \u003c\/i\u003eintroduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.\u003c\/p\u003e \u003cp\u003eIn \u003ci\u003eArtificial Plasmonics for VLSI Interconnects, \u003c\/i\u003ereaders will also find:\u003c\/p\u003e \u003cul\u003e \u003cli\u003eA cutting-edge new approach supported by pioneering research\u003c\/li\u003e \u003cli\u003eDetailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation\u003c\/li\u003e \u003cli\u003eRoadmap to future technological development in the branch of artificial plasmonics\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003e\u003ci\u003eArtificial Plasmonics for VLSI Interconnects \u003c\/i\u003eis ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.\u003c\/p\u003e\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e\u003cp\u003e\u003cb\u003ePreface \u003c\/b\u003e\u003ci\u003exiii\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAcknowledgments \u003c\/b\u003e\u003ci\u003exvii\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAbout the Companion Website \u003c\/b\u003e\u003ci\u003exix\u003cbr\u003e\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Prospects and Pitfalls of Modern Interconnect Technologies \u003c\/b\u003e\u003ci\u003e1\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1 Overview and Motivation \u003ci\u003e1\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1.1 Problem Specifics \u003ci\u003e2\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.2 Communications Challenges: Human-Level vs Machine-Level \u003ci\u003e4\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.3 Modes of Interconnects: A Technology Gap \u003ci\u003e5\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.4 Innovations in Interconnect Frontier \u003ci\u003e6\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.4.1 Interconnect Research at Material Level \u003ci\u003e6\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.4.2 Interconnect Research at the Network Level \u003ci\u003e8\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.4.3 Interconnect Research at Waveguide Level \u003ci\u003e10\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.4.4 Chip-scale Interconnect Technologies: Major Industrial Steppingstones \u003ci\u003e14\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.5 Scaling Issue of System Level Interconnect \u003ci\u003e16\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.5.1 Chip Package Signaling \u003ci\u003e18\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.5.2 Issue of Crosstalk \u003ci\u003e20\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.5.3 High Power Consumption in System-level Interconnect \u003ci\u003e22\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.6 Optical Interconnect: Evolution Toward Chip-scale Communication \u003ci\u003e23\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.6.1 Integrated Photonic Circuits on Silicon \u003ci\u003e24\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.6.2 Is Optical Interconnect Viable at Short Range? \u003ci\u003e27\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.6.3 Wireless Network on Chip \u003ci\u003e29\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.6.4 Carbon Nanotube Interconnect \u003ci\u003e32\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.7 Complexity and Dilemma in Data Transfer \u003ci\u003e33\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.7.1 The Last Centimeter Barrier: The Most Critical Distance in Data Transfer \u003ci\u003e34\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.7.2 Time Variation in Data Traffic: A Dilemma in Selecting Interconnect Technology \u003ci\u003e35\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.7.3 Do We Have Any Alternative Interconnect Technology in Hand? \u003ci\u003e35\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.7.4 Spoof Plasmon Interconnect: A New Paradigm in Communication Technology \u003ci\u003e36\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.8 Research on Spoof Plasmon Wave: Toward CMOS Compatibility \u003ci\u003e42\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.8.1 Leading Researchers on Spoof Surface Plasmon Technology \u003ci\u003e43\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.9 Summary of the Chapter \u003ci\u003e47\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e47\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Spoof Plasmonics: Origin and State-of-the-Art Development \u003c\/b\u003e\u003ci\u003e57\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1 Slow Wave Structure: A Historical Perspective \u003ci\u003e57\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1.1 Variants on Slow Wave Structures \u003ci\u003e59\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.2 Surface Plasmon Polariton in Metal \u003ci\u003e62\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.2.1 Extraordinary Transmission by Surface Plasmonics \u003ci\u003e64\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.3 Surface Plasmon Polariton: Explanation Through Drude’s Model \u003ci\u003e66\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.4 SSPP in Planar Geometry \u003ci\u003e69\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.4.1 1D Groove Pattern \u003ci\u003e69\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.5 SSPP-based THz Circuits: Research in Mazumder Laboratory \u003ci\u003e76\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.5.1 Electromagnetic Analysis of the SSPP Mode \u003ci\u003e78\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.5.2 THz SSPP Switch Design \u003ci\u003e79\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.5.3 THz SSPP Circuit Component Design \u003ci\u003e82\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.5.4 THz Biosensor Design \u003ci\u003e91\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.6 Particle-Motion Control by SSPP Waveguide \u003ci\u003e93\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.7 Recent Advances in Spoof Plasmonics \u003ci\u003e94\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.8 Conclusion \u003ci\u003e97\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e98\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Fundamental Electrodynamics of Spoof Plasmonic Mode \u003c\/b\u003e\u003ci\u003e103\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.1 Baleen Whales: What They Teach Us on Novel Communication \u003ci\u003e103\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.2 Plasmonics Aided High Speed VLSI Communication \u003ci\u003e104\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.2.1 Innovative Spice Simulation Tool Development for Plasmonics \u003ci\u003e106\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.3 A Universal Theoretical Framework for Spoof Plasmonics \u003ci\u003e109\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.3.1 Dispersion Law of SSPP Waveguides \u003ci\u003e111\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.4 Electrodynamics of Spoof Plasmon in Finite Structure \u003ci\u003e116\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.5 Modal Analysis of Spoof Plasmon \u003ci\u003e117\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.5.1 Dispersion Relation in Wide Structures \u003ci\u003e117\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.5.2 Impact of Dielectric Half-space on Dispersion \u003ci\u003e119\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.5.3 Dispersion Relation Correction in Structures of Finite Thickness \u003ci\u003e120\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.5.4 Effect of Substrate \u003ci\u003e123\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.5.5 Effective Refractive Index of a Planar SSPP \u003ci\u003e124\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.6 Thin-film of SSPP \u003ci\u003e124\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.6.1 The Concept of Effective Thickness \u003ci\u003e124\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.6.2 Capacitance Between Edges of Neighboring Conductor Plates \u003ci\u003e126\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.6.3 Effect of a Substrate on Thin SSPP \u003ci\u003e127\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.7 Properties of Confined Modes \u003ci\u003e129\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.7.1 Degree of Confinement \u003ci\u003e129\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.7.2 Bandwidth Modulation of Confined Mode \u003ci\u003e131\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.8 Summary of the Chapter \u003ci\u003e132\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e133\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Information Capacity of Spoof Plasmonic Interconnect \u003c\/b\u003e\u003ci\u003e137\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.1 The 1858 Transatlantic Telegraph: Lessons from a Failed Project \u003ci\u003e137\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.2 Data Transfer Through Noisy Channel: Condition the Signal, Don’t “Brute-Force” \u003ci\u003e138\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.3 Challenges in Millimeter-scale Communication: A Call for Innovation Beyond Shannon’s Paradigm \u003ci\u003e140\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.4 Millimeters-scale Communication: Its Growing Relevance in Data-driven World \u003ci\u003e141\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.5 A Growing Industry Investment in Millimeter-scale Chip Packaging \u003ci\u003e142\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.6 Quest for a Fundamentally Different Propagation Mode for Millimeterscale Packaging \u003ci\u003e144\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.7 Limitations of Standard Interconnect Technologies \u003ci\u003e145\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.8 Authors’ Contribution to the Field of Interconnect Design \u003ci\u003e145\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.9 Bandwidth in Crosstalk-mediated SSPP Channels \u003ci\u003e147\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.10 Traveling Length of SSPP Mode in Lossy Metal \u003ci\u003e152\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.11 Information Capacity in the Limit of Thermal Noise \u003ci\u003e154\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.12 SSPP Interconnect in Comparison with Others: The Benefit of Minimized Interference \u003ci\u003e157\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.12.1 Crosstalk in Optical Interconnect \u003ci\u003e158\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.12.2 Crosstalk in Electrical Interconnects \u003ci\u003e160\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.12.3 Crosstalk in Spoof Plasmon Interconnects \u003ci\u003e162\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.13 Dual Mode in Spoof Plasmon Waveguide \u003ci\u003e165\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.14 Summary \u003ci\u003e166\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e167\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Augmented Bandwidth by Spoof Plasmonics \u003c\/b\u003e\u003ci\u003e171\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction \u003ci\u003e171\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.2 Background Studies: Severity of Crosstalk \u003ci\u003e171\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.3 Conventional Strategies for Crosstalk Reduction \u003ci\u003e173\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.4 Authors’ Contribution: Dealing with Crosstalk in Data Bus \u003ci\u003e175\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.4.1 Advantages of Proposed Interconnect \u003ci\u003e175\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.4.2 Crosstalk Limited Bandwidth in Lossless Electrical Bus \u003ci\u003e177\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.4.3 Crosstalk Limited Bandwidth in Lossless SSPP Bus \u003ci\u003e179\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.5 Hybrid-SSPP Mode: Theory and Property Analysis \u003ci\u003e183\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.5.1 Coupling Between Two Channels of Hybrid-SSPP Mode \u003ci\u003e188\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.5.2 Coupling Among a Large Number of Parallel Hybrid-SSPP Channels \u003ci\u003e190\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.5.3 Design Technique of Hybrid-SSPP for High Frequency Modulated Data Transmission \u003ci\u003e192\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.6 Optimal Design Technique for Hybrid-SSPP Waveguide for Baseband Communication \u003ci\u003e193\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.7 Experimental Characterizations of SSPP Data Bus \u003ci\u003e194\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.7.1 Verification of Electronic-SSPP Mode \u003ci\u003e195\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.7.2 Verification of Optical-SSPP Mode \u003ci\u003e196\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.7.3 Microfabrication Process \u003ci\u003e198\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.8 Mechanism for Bandwidth Augmentation \u003ci\u003e198\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.8.1 Experimental Validation of Bandwidth Enhancement \u003ci\u003e208\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.9 How Spoof Plasmon Advances the Engineering of Interconnect \u003ci\u003e210\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.10 Summary \u003ci\u003e212\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e212\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Signal Modulation by Spoof Plasmonics \u003c\/b\u003e\u003ci\u003e215\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction \u003ci\u003e215\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.2 Background Studies: Design of Modulator \u003ci\u003e215\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.3 Authors’ Contribution in the Field of Controlling Spoof Plasmon \u003ci\u003e217\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.4 Transmission Spectra of Homogeneous and Heterogeneous Structures \u003ci\u003e218\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.5 SSPP Scattering in Heterogeneous Structures \u003ci\u003e221\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.6 \u003ci\u003eQ\u003c\/i\u003e-factor and Enhanced Radiation Rate \u003ci\u003e225\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7 Dynamic Switching of SSPP Transmission Property \u003ci\u003e226\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7.1 SSPP Dispersion in the Presence of Modulator:Theoretical Framework \u003ci\u003e227\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7.2 Prediction of Dispersion-limited Modulation Speed \u003ci\u003e232\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7.3 Analysis of Energy Efficiency \u003ci\u003e234\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7.4 Numerical Analysis \u003ci\u003e235\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7.5 Trade-off Between Modulation Speed and Energy-efficiency \u003ci\u003e237\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.7.6 Extension of the Theory for a Broad Class of SSPP Modulators \u003ci\u003e238\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.8 Experimental Considerations and Signal Modulation \u003ci\u003e240\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.8.1 Design Considerations \u003ci\u003e240\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.8.2 Transmission Characteristics \u003ci\u003e241\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.8.3 Modulation Characteristics \u003ci\u003e244\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.9 Summary \u003ci\u003e248\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e248\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Process Variation Effect on Spoof Plasmonic \u003c\/b\u003e\u003cb\u003eInterconnect: Compensations \u003c\/b\u003e\u003ci\u003e253\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction \u003ci\u003e253\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.2 Background Studies: Process Variation in Interconnects \u003ci\u003e253\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.3 Author’s Contribution in the Field of Spoof Plasmon Signal Restoration \u003ci\u003e254\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.4 Frequency Response of SSPP Channel \u003ci\u003e254\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.4.1 SSPP Channel with Ideal Pattern \u003ci\u003e254\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.4.2 SSPP with Pattern Irregularity \u003ci\u003e255\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.5 Performance Loss for Structural Imperfections \u003ci\u003e257\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.5.1 Bandwidth Degradations \u003ci\u003e257\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.5.2 Loss of Signal Integrity \u003ci\u003e258\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.6 Mitigation of Performance Degradation \u003ci\u003e260\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.6.1 Mathematical Functions to Compensate for Signal Loss \u003ci\u003e260\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.6.2 Nonlinear Circuit Design for Real-time Compensations \u003ci\u003e261\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.6.3 Dynamic Tunability of Compensation Circuit \u003ci\u003e262\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.7 Summary \u003ci\u003e263\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003eReferences \u003ci\u003e264\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Future Research Avenues for Spoof Plasmonic Interconnects \u003c\/b\u003e\u003ci\u003e265\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction \u003ci\u003e265\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.2 New Research Frontiers for Spoof Plasmonic Interconnect \u003ci\u003e266\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.2.1 New Material Integration with Spoof Plasmonics \u003ci\u003e266\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.2.2 Spoof Plasmonics for Higher Device Integration \u003ci\u003e268\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.2.3 Nanoscale Realization of Spoof Plasmonic Interconnect \u003ci\u003e269\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.2.4 Development of Multi-level Computation Model for THz Surface Wave Network \u003ci\u003e270\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.3 Summary of the Chapter \u003ci\u003e273\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eIndex \u003c\/b\u003e\u003ci\u003e275\u003c\/i\u003e\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Civil engineering, surveying \u0026amp; building [\u003ca title=\"See our other books on Civil engineering, surveying \u0026amp; building\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Civil%20engineering,%20surveying%20\u0026amp;%20building%20%5BTN%5D%22\"\u003eTN\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Brand 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