{"product_id":"advanced-electronic-packaging-hardback-9780471466093","title":"Advanced Electronic Packaging (Hardback) 9780471466093","description":"\u003cfont face=\"Georgia\"\u003e\r\n\u003cp\u003e\u003cfont size=\"6\"\u003eAdvanced Electronic Packaging\u003c\/font\u003e\u003cbr\u003e\r\n\r\n\r\n\r\n\r\n\r\n\u003c\/p\u003e\n\u003cp\u003e\u003cfont size=\"4\"\u003eRichard K. Ulrich (Edited by), Brown (Author), William D. Brown (Edited by)\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e9780471466093, Wiley\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eHardback, published 23 May 2006\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003e848 pages\u003cbr\u003e25.8 x 18.3 x 4.5 cm, 1.554 kg\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\r\n\u003cp align=\"justify\"\u003e\u003cem\u003e\u003cfont size=\"3\"\u003e\"…a very nice reference.\" (\u003ci\u003eIEEE Circuits \u0026amp; Devices Magazine\u003c\/i\u003e, November\/December 2006)  \u003cp\u003e\"...offers a broad perspective on electronic packaging.\" (\u003ci\u003eAdvanced Packaging Online\u003c\/i\u003e, August 11, 2006)\u003c\/p\u003e \u003cp\u003e\"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off.\" (\u003ci\u003eChip Scale Review\u003c\/i\u003e, July 2006)\u003c\/p\u003e \u003cp\u003e\"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies.\" (\u003ci\u003eCircuiTree\u003c\/i\u003e, May 1, 2006)\u003c\/p\u003e\u003c\/font\u003e\u003c\/em\u003e\u003c\/p\u003e\r\n\r\n\u003cp align=\"justify\"\u003e\u003cstrong\u003e\u003cfont size=\"3\"\u003eAs in the \u003ci\u003eFirst Edition\u003c\/i\u003e, each chapter in this new \u003ci\u003eSecond Edition\u003c\/i\u003e is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the \u003ci\u003eFirst Edition\u003c\/i\u003e, which became an industry standard and a popular graduate-level textbook, have been retained.\u003cbr\u003e \u003cbr\u003e An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.\u003c\/font\u003e\u003c\/strong\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eChapter 1: Introduction and overview of microelectronic packaging.  \u003cp\u003eChapter 2: Materials for microelectronic packaging.\u003c\/p\u003e \u003cp\u003eChapter 3: Processing technologies.\u003c\/p\u003e \u003cp\u003eChapter 4: Organic printed circuit board materials and processes.\u003c\/p\u003e \u003cp\u003eChapter 5: Ceramic substrates.\u003c\/p\u003e \u003cp\u003eChapter 6: Electrical considerations, modeling, and simulation.\u003c\/p\u003e \u003cp\u003eChapter 7: Thermal considerations.\u003c\/p\u003e \u003cp\u003eChapter 8: Mechanical design considerations.\u003c\/p\u003e \u003cp\u003eChapter 9: Discrete and embedded passive devices.\u003c\/p\u003e \u003cp\u003eChapter 10: Electronic package assembly.\u003c\/p\u003e \u003cp\u003eChapter 11: Design considerations.\u003c\/p\u003e \u003cp\u003eChapter 12: Radio frequency and microwave packaging.\u003c\/p\u003e \u003cp\u003eChapter 13: Power electronics packaging.\u003c\/p\u003e \u003cp\u003eChapter 14: Multichip and three-dimensional packaging.\u003c\/p\u003e \u003cp\u003eChapter 15: Packaging of MEMS and MOEMS: challenges and a case study.\u003c\/p\u003e \u003cp\u003eChapter 16: Reliability considerations.\u003c\/p\u003e \u003cp\u003eChapter 17: Cost evaluation and analysis.\u003c\/p\u003e \u003cp\u003eChapter 18: Analytical techniques for materials characterization.\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\u003cp\u003e\u003cfont size=\"3\"\u003eSubject Areas: Electronics \u0026amp; communications engineering [\u003ca title=\"See our other books on Electronics \u0026amp; communications engineering\" href=\"https:\/\/freshlyprintedbooks.co.uk\/search?q=%22Electronics%20\u0026amp;%20communications%20engineering%20%5BTJ%5D%22\"\u003eTJ\u003c\/a\u003e]\u003c\/font\u003e\u003c\/p\u003e\r\n\r\n\r\n\u003c\/font\u003e","brand":"Wiley-IEEE Press","offers":[{"title":"Brand New","offer_id":52293483364632,"sku":"9780471466093","price":121.67,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0730\/2037\/5320\/files\/9780471466093.jpg?v=1781641563","url":"https:\/\/freshlyprintedbooks.co.uk\/products\/advanced-electronic-packaging-hardback-9780471466093","provider":"Freshly Printed Books","version":"1.0","type":"link"}